Zobrazeno 1 - 10
of 37
pro vyhledávání: '"Mohammed Alhendi"'
Autor:
Charles Lynch, Ajibayo Adeyeye, El Mehdi Abbara, Ashraf Umar, Mohammed Alhendi, Chris Minnella, Joseph Iannotti, Nancy Stoffel, Mark Poliks, Manos M. Tentzeris
Publikováno v:
Scientific Reports, Vol 14, Iss 1, Pp 1-12 (2024)
Abstract With the current development of the 5G infrastructure, there presents a unique opportunity for the deployment of battery-less mmWave reflect-array-based sensors. These fully-passive devices benefit from having a larger detectability than alt
Externí odkaz:
https://doaj.org/article/97afb22075c548b1a783a942b8680352
Autor:
Saurabh Khuje, Firas Alshatnawi, Mohammed Alhendi, Jian Yu, Aaron Sheng, Yulong Huang, Cheng‐Gang Zhuang, Jason Armstrong, Chi Zhou, Mark Poliks, Shenqiang Ren
Publikováno v:
Advanced Electronic Materials, Vol 9, Iss 3, Pp n/a-n/a (2023)
Abstract Advanced materials, electrically conductive and oxidation resistant, are frontrunners for technological advancements in cutting‐edge high‐temperature electronics. Rational design and manufacturing of hierarchical material structures is i
Externí odkaz:
https://doaj.org/article/bda675f779f8462f9478f5335bb8517a
Autor:
Ashraf Umar, Mohamed Y. Abdelatty, Abdullah Obeidat, Emuobosan Enakerakpo, Mohammed Alhendi, Mark. D. Poliks
Publikováno v:
IMAPSource Proceedings. 2022
There is growing interest in the use of additive manufacturing for the fabrication of RF devices due to fast prototyping capabilities and the use of less material as opposed to traditional fabrication techniques. In addition to the previously mention
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b779a75f858c86a54773fed24399d7c0
https://doi.org/10.4071/001c.74623
https://doi.org/10.4071/001c.74623
Autor:
Mohamed Y. Abdelatty, Ashraf Umar, Abdullah S. Obeidat, Emuobosan Enakerakpo, Mohammed Alhendi, Mark. D. Poliks
Publikováno v:
IMAPSource Proceedings. 2022
Cross-hatching of PCB grounds refers to a process in which certain ground planes appear as copper lattices; regular openings are placed at regular intervals. Nowadays, the efficacy of ground hatching on rigid PCBs is minimal. However, it is becoming
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c8d1f4f51339953d6d46375d41111e30
https://doi.org/10.4071/001c.74544
https://doi.org/10.4071/001c.74544
Publikováno v:
Journal of Simulation. 17:211-227
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d67eecb52706b6d510028c5a717c75d7
https://doi.org/10.1080/17477778.2021.1991850
https://doi.org/10.1080/17477778.2021.1991850
Publikováno v:
International Symposium on Microelectronics. 2021:000189-000194
There is growing interest in extreme temperature electronics to support the mission needs to sense, actuate, and communicate at temperatures beyond the normal range of operations in commercial and military applications. Reliable packaging in the temp
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::96cc1d538b51074d27b24ea2ad6c4559
https://doi.org/10.4071/1085-8024-2021.1.000189
https://doi.org/10.4071/1085-8024-2021.1.000189
Autor:
Ludovico Cestarollo, Nancy C. Stoffel, Gurvinder Singh Khinda, Rajesh Sharma Sivasubramony, Joe Iannotti, Darshana L. Weerawarne, Mark D. Poliks, Peter Borgesen, Mohammed Alhendi
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 11:683-689
The ability to fabricate smooth transitions between surfaces at different levels is critical for the establishment of robust printed interconnections in flexible hybrid electronics devices. In this article, precision dispensing of die fillets is prov
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ba1c9451f45f8074a315e0ca229d7dbe
https://doi.org/10.1109/tcpmt.2021.3066455
https://doi.org/10.1109/tcpmt.2021.3066455
Autor:
Emuobosan Enakerakpo, Ashraf I. Umar, Mohammed Alhendi, Dylan Richmond, Mark D. Poliks, Tom Rovere, Stephen Gonya
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cd9d45bf929d230529a71e9751c8e271
https://doi.org/10.1109/ectc51906.2022.00302
https://doi.org/10.1109/ectc51906.2022.00302
Autor:
El Mehdi Abbara, Gurvinder Singh Khinda, Mohammed Alhendi, Riadh Alhaidari, Firas Alshatnawi, Behnam Garakani, Udara S. Somarathna, Mark D. Poliks
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a7a62ca7e7058b5333da926b871e45e9
https://doi.org/10.1109/ectc51906.2022.00131
https://doi.org/10.1109/ectc51906.2022.00131
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0df35182bb5abe1000ac8c431a364f81
https://doi.org/10.1109/ectc51906.2022.00363
https://doi.org/10.1109/ectc51906.2022.00363