Zobrazeno 1 - 10
of 26
pro vyhledávání: '"Mohamed Mehdi Jatlaoui"'
Autor:
Casey Hardy, Hieu Pham, Mohamed Mehdi Jatlaoui, Frederic Voiron, Tianshi Xie, Po-Han Chen, Saket Jha, Patrick Mercier, Hanh-Phuc Le
Publikováno v:
2023 IEEE International Solid- State Circuits Conference (ISSCC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3bcfed07af3a27094a38d9912e96f9e2
https://doi.org/10.1109/isscc42615.2023.10067315
https://doi.org/10.1109/isscc42615.2023.10067315
Autor:
Mohamed Mehdi Jatlaoui, Seiji Hidaka, Ryo Kasai, Sho Kubota, Masato Takesawa, Charles Muller, Florent Lallemand, Shunsuke Abe, Takashi Takeuchi, Hitoshi Matsuno
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5d1fdcc9a00d829d3d29200f5260d4ca
https://doi.org/10.1109/ectc51906.2022.00148
https://doi.org/10.1109/ectc51906.2022.00148
Publikováno v:
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0b317fff55836dca8142086d5e37ed69
https://doi.org/10.1109/eptc53413.2021.9663987
https://doi.org/10.1109/eptc53413.2021.9663987
Publikováno v:
2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D).
Low temperature solders usage for broadband assemblies represent an important challenge for the industry. Using lower temperatures for reflow subsequently shows less deformation on mother boards used for optical sub-assemblies and then less RF parasi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b30673c6f047a40d68530cab48fdf00f
https://doi.org/10.1109/ltb-3d53950.2021.9598388
https://doi.org/10.1109/ltb-3d53950.2021.9598388
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
Both in Mobile and High-performance Computing (HPC) applications, efficient power supply of the processors was and is still being a big challenge for designers. Indeed, for these applications the power consumption is increasing while the power supply
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::109e7c2b4e4f4c54ddeb83398e6d897c
https://doi.org/10.1109/ectc32696.2021.00210
https://doi.org/10.1109/ectc32696.2021.00210
Autor:
Takahito Kushima, Stephane Longuet, Sophie Gaborieau, Tatsuya Ohara, Hiroyuki Nakano, Shota Ando, Mohamed Mehdi Jatlaoui, Takahiro Matsuoka, Laurent Dubos, Yves Aubry
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
The work presented here is driven by the motivation to design and manufacture a LiDAR module generating a short pulse with high output LD (Laser Diode) power peak. As will be demonstrated in this paper, this was made possible by the use of high volta
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bda75bdc75cdce190cd192ded43fe058
https://doi.org/10.1109/ectc32696.2021.00051
https://doi.org/10.1109/ectc32696.2021.00051
Autor:
Mohamed Mehdi Jatlaoui, Charles Muller
Publikováno v:
2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC).
One of the key issues in today's 3D integration topic is to correctly design and assemble silicon-related technologies (ICs, IPDs, Si-interposers and so on) with non-silicon-related technologies (ceramic components, plastic molded chips, crystal osci
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::02fb858d88d8430aa3b7c1f7386aa3af
https://doi.org/10.1109/eptc50525.2020.9315000
https://doi.org/10.1109/eptc50525.2020.9315000
Autor:
Florian Krismer, D. Bremner, Gerd Schlottig, Pritish R. Parida, Wolfram Steller, Paul McCloskey, Johann W. Kolar, Pedro A. M. Bezerra, Bruno Michel, Thomas Brunschwiler, Hermann Oppermann, Frederic Voiron, J. Kleff, Arvind Sridhar, Patrick Ruch, Zoran Pavlovic, Mohamed Mehdi Jatlaoui, Neil Ebejer
Publikováno v:
2017 IEEE International Electron Devices Meeting (IEDM).
Novel heat removal and power delivery topologies are required to enable ‘extreme 3D integration’ with cube-sized compute nodes. Therefore, a technology roadmap is presented supporting memory-on-logic and logic-on-logic in the medium and long-term
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::182bb04da667a16ecc44b11e94079cc2
https://doi.org/10.1109/iedm.2017.8268322
https://doi.org/10.1109/iedm.2017.8268322
Autor:
Anya Traille, Patrick Pons, Franck Chebila, Hamida Hallil, Sofiene Bouaziz, Manos M. Tentzeris, Philippe Menini, Mohamed Mehdi Jatlaoui, Ayoub Rifai, Hervé Aubert, Trang Thai
Publikováno v:
annals of telecommunications - annales des télécommunications. 68:425-435
In this paper, we present the wireless measurement of various physical quantities from the analysis of the radar cross section variability of passive electromagnetic sensors. The technique uses a millimeter frequency-modulated continuous-wave radar f
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ca414d803dc7383e8307991762c8c0c7
https://doi.org/10.1007/s12243-013-0376-5
https://doi.org/10.1007/s12243-013-0376-5
Publikováno v:
Instrumentation Mesure Métrologie. 11:67-88
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2a1f33a74bc0043fffbefe7ef0e04180
https://doi.org/10.3166/i2m.11.3-4.67-88
https://doi.org/10.3166/i2m.11.3-4.67-88