Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Mohamed Benabdeladhim"'
Publikováno v:
AEU - International Journal of Electronics and Communications. 100:56-65
This paper presents the design and implementation of a low power and ultrafast spike-timing dependent plasticity (STDP) of the spiking neural network (SNN) in a crossbar structure based on the ferroelectric tunnel memristor (FTM) where the nonlinear
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3c336b244e6dea7b5a7e2b2ba4a8462e
https://doi.org/10.1016/j.aeue.2019.01.003
https://doi.org/10.1016/j.aeue.2019.01.003
Publikováno v:
International Journal of Advanced Computer Science and Applications. 9
Three-dimensional integrated circuits (3D-ICs) based on Through-Silicon-Vias (TSVs) interconnection technology appeared as a viable solution to overcome problems of cost, reliability, yield and stacking area. In order to be commercially feasible, the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::43da22f6fc0eb7b37997a6485168105a
https://doi.org/10.14569/ijacsa.2018.090737
https://doi.org/10.14569/ijacsa.2018.090737
Publikováno v:
2017 International Conference on Engineering & MIS (ICEMIS).
This paper presents an Interconnect Built-In Self-Repair (IBISR) strategies for Through Silicon Via (TSV) in three dimension integrated circuits (3D-IC). The proposed IBISR structure focuses on testing of specific defective TSV by using Interconnect
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3b67bf1ed7c96d9e13aecf29df89d718
https://doi.org/10.1109/icemis.2017.8273102
https://doi.org/10.1109/icemis.2017.8273102
Publikováno v:
2015 2nd World Symposium on Web Applications and Networking (WSWAN).
TSV or interconnect between chips have as a promising solution for overcoming interconnect and power bottlenecks in 3D IC. However, testing of 3D ICs remains a significant challenge, and breakthroughs in test technology are needed to make 3D integrat
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e0af0f4f2e6f30d1eba39eff16e19fcc
https://doi.org/10.1109/wswan.2015.7210312
https://doi.org/10.1109/wswan.2015.7210312