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pro vyhledávání: '"Mogumi Chiyoda-ku Takemoto"'
Autor:
Shigeki Maekawa, K. Miki, Mogumi Chiyoda-ku Takemoto, Y. Deguchi, Yoshihiro Kashiba, T. Nagata
Publikováno v:
2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).
A probe card with tungsten probes (needles) is conventionally used for wafer testing. However, the electrical contact between a probe and an aluminum bonding pad becomes unstable, due to the adhesive pick-up of aluminum on the probe tip. In order to
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::92b9e5a55eb6e4b329f79e1d88073370
https://doi.org/10.1109/ectc.2000.853317
https://doi.org/10.1109/ectc.2000.853317
