Zobrazeno 1 - 10
of 14
pro vyhledávání: '"Moganraj Palianysamy"'
Autor:
Muhammad Hafiz Ab Aziz, Zaliman Sauli, Vithyacharan Retnasamy, Wan Mokhdzani Wan Norhaimi, Moganraj Palianysamy, Hussin Kamarudin
Publikováno v:
Advanced Materials Research. 1082:437-440
In this paper, the bondability of silicon bonded to different glass based material was studied by analyzing the bond strength comparison using the anodic bonding approach. The three types of glass based surface used were silica, pyrex, and soda lime
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8e15c64a3bed7af957cfc8cba39b5581
https://doi.org/10.4028/www.scientific.net/amr.1082.437
https://doi.org/10.4028/www.scientific.net/amr.1082.437
Autor:
Moganraj Palianysamy, Hussin Kamarudin, Muhammad Hafiz Ab Aziz, Vithyacharan Retnasamy, Zaliman Sauli, Wan Mokhdzani Wan Norhaimi
Publikováno v:
Advanced Materials Research. 1082:416-419
This paper reports on the bond strength comparison between silicon and different glass based materials via anodic bonding approach. The two types of glass based surface used were silica and pyrex. Silicon will be placed on the positive terminal and g
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0a0b6f782ae7ce07f7ff4ade0c7f9bf8
https://doi.org/10.4028/www.scientific.net/amr.1082.416
https://doi.org/10.4028/www.scientific.net/amr.1082.416
Publikováno v:
Applied Mechanics and Materials. 680:111-114
A study on the resistance of directly sputtered films and treated films of Indium Tin Oxide (ITO) is done to initiate an extensive study on the material. This study involves variation in terms of number of layers and duration of deposition. Treated f
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::74af897163eff37252de4b0edc496ea8
https://doi.org/10.4028/www.scientific.net/amm.680.111
https://doi.org/10.4028/www.scientific.net/amm.680.111
Publikováno v:
Applied Mechanics and Materials. 680:102-105
Preliminary analysis has been done on the reflectance of sputtered Indium Tin Oxide (ITO) layers. The analysis is done for two different types of layers which is the directly sputtered ITO films and the treated ITO films. In both type of the film it
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f14062907c654c87221d37599afbb6cd
https://doi.org/10.4028/www.scientific.net/amm.680.102
https://doi.org/10.4028/www.scientific.net/amm.680.102
Autor:
K. Anwar, Nooraihan Abdullah, Moganraj Palianysamy, N. I. M. Nor, Zaliman Sauli, Vithyacharan Retnasamy
Publikováno v:
Procedia - Social and Behavioral Sciences. 129:512-517
Barium Strontium Titanate (BST) thin films have been proven as a material for various advance integrated circuit applications.This paper presents the relationship between spin coating speed, heat treatment time, and annealing temperature in response
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::e0d90c847be868b6ee051df7e8a96f8f
Autor:
Moganraj Palianysamy, Vithyacharan Retnasamy, Ramzan Mat Ayub, Steven Taniselass, Uda Hashim, Zaliman Sauli
Publikováno v:
Advanced Materials Research. 925:140-143
Reactive Ion Etching (RIE) is an important process in fabrication of semiconductor devices. Design Of Experiment (DOE) has been used to study the effect of Reactive Ion Etch (RIE) towards surface morphology of aluminum bond pad. Important RIE factors
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::5b83d465255f01c8ecb635f6ed377c9e
https://doi.org/10.4028/www.scientific.net/amr.925.140
https://doi.org/10.4028/www.scientific.net/amr.925.140
Autor:
Aaron Koay Terr Yeow, Vithyacharan Retnasamy, Uda Hashim, Zaliman Sauli, Rajendaran Vairavan, Moganraj Palianysamy, Ramzan Mat Ayub
Publikováno v:
Advanced Materials Research. 925:88-91
This paper presents the correlation between electroless process time, immersion gold process time and the bump height in electroless nickel immersion gold (ENIG). A certain bump height need to be achieved in order to create acceptable solder bumps fo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8c8de5f5779f3c522b80750336b70604
https://doi.org/10.4028/www.scientific.net/amr.925.88
https://doi.org/10.4028/www.scientific.net/amr.925.88
Autor:
Ramzan Mat Ayub, Moganraj Palianysamy, Steven Taniselass, Vithyacharan Retnasamy, Uda Hashim, Zaliman Sauli
Publikováno v:
Advanced Materials Research. 925:92-95
This study reports on the preliminary investigations on the effect of Reactive Ion Etch (RIE) parameters on the surface characteristics of Al bond pad. Investigation is done employing Design of Experiment (DOE) method. Quantity of Oxygen, Argon, ICP
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2e8b5debdf0dc0c0c590494af789d318
https://doi.org/10.4028/www.scientific.net/amr.925.92
https://doi.org/10.4028/www.scientific.net/amr.925.92
Autor:
Phaklen Ehkan, Steven Taniselass, Vithyacharan Retnasamy, Moganraj Palianysamy, Fairul Afzal Ahmad Fuad, Zaliman Sauli
Publikováno v:
Advanced Materials Research. 896:233-236
Wettability is one of the most important aspects in microfluid technology. The effect of surface roughness on the wettability by a liquid has been studied experimentally using Design of Experiment(DOE). Sixteen samples were etched using Reactive Ion
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::dceaa6f1adab686d9d70fb5fd6a05447
https://doi.org/10.4028/www.scientific.net/amr.896.233
https://doi.org/10.4028/www.scientific.net/amr.896.233
Autor:
Moganraj Palianysamy, Phaklen Ehkan, Vithyacharan Retnasamy, Fairul Afzal Ahmad Fuad, Zaliman Sauli, Aaron Koay Terr Yeow
Publikováno v:
Applied Mechanics and Materials. 404:67-71
Reactive Ion Etch (RIE) has been an important process in the world of microelectronic fabrication. Focus of this preliminary study is on how RIE affects the grain size of aluminum film which is fabricated on substrates. RIE parameters are varied to o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::77eaab803bc006da3b9133a1431354fb
https://doi.org/10.4028/www.scientific.net/amm.404.67
https://doi.org/10.4028/www.scientific.net/amm.404.67