Zobrazeno 1 - 4
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pro vyhledávání: '"Mofarah, S. S."'
Publikováno v:
Computational Materials Science, Volume 178, 1 June 2020, 109632
Molecular dynamics simulation is used to study vacancy cluster formation in $\beta$- and $\alpha$-$Si_3N_4$ with varying vacancy contents (0 - 25.6 at%). Vacancies are randomly created in supercells, which were subsequently heat-treated for 114 nanos
Externí odkaz:
http://arxiv.org/abs/2003.13051
Akademický článek
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Molecular dynamics simulation is used to study vacancy cluster formation in $��$- and $��$-$Si_3N_4$ with varying vacancy contents (0 - 25.6 at%). Vacancies are randomly created in supercells, which were subsequently heat-treated for 114 nano
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0e9a3ed4353ec8c206ed7f6a092edee9
Autor:
Shahmiri R; School of Materials Science and Engineering, UNSW Sydney, Sydney, NSW 2052, Australia; Engineering Dental Master Technology, Sydney, NSW 2007, Australia. Electronic address: r.shahmiri@unsw.edu.au., Standard OC; School of Materials Science and Engineering, UNSW Sydney, Sydney, NSW 2052, Australia., Hart JN; School of Materials Science and Engineering, UNSW Sydney, Sydney, NSW 2052, Australia., Gharagozlu N; Engineering Dental Master Technology, Sydney, NSW 2007, Australia., Bahmanrokh G; School of Materials Science and Engineering, UNSW Sydney, Sydney, NSW 2052, Australia., Yin Y; Electron Microscope Unit, UNSW Sydney, Sydney, NSW 2052, Australia., Mofarah SS; School of Materials Science and Engineering, UNSW Sydney, Sydney, NSW 2052, Australia., Adabifiroozjaei E; Advanced Electron Microscopy (AEM), Materials Science Department, Technical University of Darmstadt, Darmstadt, Germany., Webster R; Electron Microscope Unit, UNSW Sydney, Sydney, NSW 2052, Australia., Sorrell CC; School of Materials Science and Engineering, UNSW Sydney, Sydney, NSW 2052, Australia.
Publikováno v:
Dental materials : official publication of the Academy of Dental Materials [Dent Mater] 2024 Dec; Vol. 40 (12), pp. 2148-2156. Date of Electronic Publication: 2024 Oct 28.