Zobrazeno 1 - 10
of 18
pro vyhledávání: '"Miyuki, Akazawa"'
Autor:
Daisuke Kitayama, Hiroshi Kudo, Takahiro Tai, Haruo Iida, Shouhei Yamada, Masaya Tanaka, Kouji Sakamoto, Miyuki Akazawa, Takamasa Takano
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
A previously presented topside Cu-filled through-glass-via channel (a “Cu bridge”) is expected to be better able to support high-speed high-density signal processing in multi-chiplet systems than Cu through-glass vias based on existing electropla
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7536047ba09cde7dd2713714cf4d13e2
https://doi.org/10.1109/ectc32696.2021.00169
https://doi.org/10.1109/ectc32696.2021.00169
Publikováno v:
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
Use of dry plasma etching rather than wet etching of a Cu-seed layer in a semi-additive process enabled more precise dimension controllability in the patterning of submicron-scale Cu traces due to no shift in the width of the traces. This controllabi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::049be3e0aa1b98861bc575e15b95307d
https://doi.org/10.1109/ectc.2019.00022
https://doi.org/10.1109/ectc.2019.00022
Autor:
Jyunichi Suyama, Daisuke Kitayama, Miyuki Akazawa, Hiroshi Kudo, Yumi Okazaki, Tanaka Masaya, Ryohei Kasai, Kouji Sakamoto, Haruo Iida, Satoru Kuramochi, Shouhei Yamada, Yuuki Aritsuka, Mitsuhiro Takeda, Takamasa Takano, Hiroaki Sato
Publikováno v:
2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC).
The fabrication of a 2.5D glass interposer was demonstrated, and its electrical performance, including signal transmission, was characterized. Single-sided multi-level enhanced copper redistribution layers were fabricated on a glass substrate with th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a2a5d68846411db9edf5be51d9cd6970
https://doi.org/10.23919/icep.2018.8374332
https://doi.org/10.23919/icep.2018.8374332
Autor:
Daisuke Kitayama, Hiroshi Kudo, Jyunichi Suyama, Shouhei Yamada, Satoru Kuramochi, Miyuki Akazawa, Kouji Sakamoto, Ryohei Kasai, Yumi Okazaki, Hiroaki Sato, Mitsuhiro Takeda, Haruo Iida
Publikováno v:
2017 IEEE CPMT Symposium Japan (ICSJ).
Downsizing the Cu signal traces in the redistribution layer is an effective approach to increasing the number of signal I/O lines and thereby greatly increasing signal processing performance between logic and memory chips in advanced fine-pitch packa
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2afd95dcab8f482bad22764ac26a0628
https://doi.org/10.1109/icsj.2017.8240055
https://doi.org/10.1109/icsj.2017.8240055
Autor:
Satoru Kuramochi, Takamasa Takano, Kousuke Suzuki, Yoshitaka Fukuoka, Sumio Koiwa, Miyuki Akazawa, Hiroshi Mawatari
Publikováno v:
International Symposium on Microelectronics. 2014:000376-000381
As electronic product becomes smaller and lighter with an increasing number of function ↚ the demand for high density and high integration becomes stronger. Interposers for system in package will became more and more important for advanced electron
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b7a246fc33d27f85f3f390810c886e09
https://doi.org/10.4071/isom-wa11
https://doi.org/10.4071/isom-wa11
Autor:
Satoru Kuramochi, Masaya Tanaka, Hiroshi Mawatari, Yoshitaka Fukuoka, Hiroshi Kudo, Miyuki Akazawa
Publikováno v:
2016 IEEE CPMT Symposium Japan (ICSJ).
As electronic product becomes smaller and lighter with an increasing number of function, the demand for high density and high integration becomes stronger. Interposers for system in package will became more and more important for advanced electronic
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2c706505ceb65ed7772a8d00c28a859f
https://doi.org/10.1109/icsj.2016.7801263
https://doi.org/10.1109/icsj.2016.7801263
Autor:
Miyuki Akazawa, Hiroshi Mawatari, Hiroshi Kudo, Yoshitaka Fukuoka, Masaya Tanaka, Satoru Kuramochi
Publikováno v:
2016 6th Electronic System-Integration Technology Conference (ESTC).
As electronic product becomes smaller and lighter with an increasing number of function, the demand for high density and high integration becomes stronger. Interposers for system in package will became more and more important for advanced electronic
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1b54852329650492a40b9ca7a160487e
https://doi.org/10.1109/estc.2016.7764697
https://doi.org/10.1109/estc.2016.7764697
Autor:
Sara Hunegnaw, Tafadzwa Magaya, Michael Merschky, Satoru Kuramochi, Jun Wang, Akira Mieno, Aric Shorey, Zhiming Liu, Miyuki Akazawa, Hailuo Fu, Hobie Yun
Publikováno v:
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
High performance radio frequency (RF) front end filters were fabricated using glass interposer and 3D packaging technologies, especially through glass vias (TGV) and direct Cu metallization on the glass. Major challenges for the use of TGV in RF and
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8547d4272c0a68cd4af3c3ab40fd7ef6
https://doi.org/10.1109/ectc.2016.230
https://doi.org/10.1109/ectc.2016.230
Autor:
Daisuke Kitayama, Miyuki Akazawa, Hiroyuki Sato, Masaya Tanaka, Kouji Sakamoto, Hiroshi Mawatari, Yumi Okazaki, Ryohhei Kasai, Hiroshi Kudo, Shouhei Yamada, Toshio Sasao, Susumu Tashiro, Naoki Oota, Satoru Kuramochi, Haruo Iida, Takamasa Takano, Mitsuhiro Takeda, Jyunichi Suyama
Publikováno v:
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
An enhanced redistribution layer architecture has been developed in which the Cu wires are directly covered with a double layer consisting of two types of dielectrics by using a semi-additive process. The double layer enhanced the thermal and electri
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c989cb81643fa8b51aa38b80758c324b
https://doi.org/10.1109/ectc.2016.69
https://doi.org/10.1109/ectc.2016.69
Autor:
Hiroshi Mawatari, Hiroyuki Nagano, Satoru Kuramochi, Yoshitaka Fukuoka, Sumio Koiwa, Kousuke Suzuki, Jiro Iida, Miyuki Akazawa
Publikováno v:
2016 Pan Pacific Microelectronics Symposium (Pan Pacific).
As electronic products becomes smaller and lighter with an increasing number of function, the demand for high density and high integration becomes stronger. Interposers for system in package will became more and more important for advanced electronic
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4a9a07cbcb73d9af25b67d218f6f296a
https://doi.org/10.1109/panpacific.2016.7428426
https://doi.org/10.1109/panpacific.2016.7428426