Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Miyang Kim"'
Publikováno v:
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::642f8440a7c9b6d7e1004dbb55a67f68
https://doi.org/10.1109/eptc56328.2022.10013189
https://doi.org/10.1109/eptc56328.2022.10013189
Autor:
Wonju Park, Miyang Kim
Publikováno v:
The Journal of Humanities and Social sciences 21. 11:503-518
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cf1c02cd390b8251d1dd5c277e62d50b
https://doi.org/10.22143/hss21.11.6.37
https://doi.org/10.22143/hss21.11.6.37
Autor:
Miyang Kim, Han Kim, Jong Yun Kim, Sangeun Park, Jaelim Choi, Soo-Young Ji, Eun-Ju Yang, Daechul Choi
Publikováno v:
International Symposium for Testing and Failure Analysis.
In this paper, we demonstrate a case for non-destructive detection of submicron wide via-crack in printed circuit boards (PCBs) by using in-situ thermal chamber 3D x-ray computed tomography. The defect location is verified by a PFA (Physical Failure
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::710562fc7c8e09f9bcfa35b77dd6afe7
https://doi.org/10.31399/asm.cp.istfa2020p0314
https://doi.org/10.31399/asm.cp.istfa2020p0314
Publikováno v:
ECS Meeting Abstracts. :641-641
not Available.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::67a322fdc77c3093df32a0fb7a0c65cd
https://doi.org/10.1149/ma2009-01/14/641
https://doi.org/10.1149/ma2009-01/14/641
Publikováno v:
SID Symposium Digest of Technical Papers. 36:332
Mo layer is used as a protective layer of Al metal line causing problems such as hillock and oxidation in TFT-LCDs. When the insulating SiNx and passivation layer is etched to form a contact hole in Mo/Al/Mo trilayered metal line, the upper Mo layer
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::18981eaa0f2c2c3a3bb1ad677c2b27bd
https://doi.org/10.1889/1.2036439
https://doi.org/10.1889/1.2036439
Publikováno v:
Journal of The Electrochemical Society; 2010, Vol. 157 Issue 12, pD620-D623, 4p