Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Mitsuru Hiroshima"'
Publikováno v:
Handbook of 3D Integration: 3D Process Technology
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4a014952eb984a73cb851a5a947469f2
https://doi.org/10.1002/9783527670109.ch25
https://doi.org/10.1002/9783527670109.ch25
We found that self-alignment accuracy was better than ±2 m in the case with an initial offset of up to 1 mm. This method, driven by the surface tension force of the liquid, offers new technical solutions for both high accuracy chip bonding and low c
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::fdfb4f22faca176026929d1d68412a14
https://publica.fraunhofer.de/handle/publica/233801
https://publica.fraunhofer.de/handle/publica/233801
Autor:
Josef Weber, Karlheinz Bock, Mitsuru Hiroshima, Christof Landesberger, Bernhard Oberhofer, Sabine Scherbaum
Publikováno v:
2012 4th Electronic System-Integration Technology Conference.
Thin silicon chips with a thickness of 50 μm are of light weight and are able to swim on droplets of fluids like for instance water. If the liquid shows a specific wetting behavior with respect to the underlying substrate then droplet and chip can m
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::86c3bdda92969ec925078cacb22f6098
https://doi.org/10.1109/estc.2012.6542177
https://doi.org/10.1109/estc.2012.6542177
