Zobrazeno 1 - 10
of 18
pro vyhledávání: '"Mitsuji Okada"'
Publikováno v:
IEEE Solid-State Circuits Letters. 6:65-68
Publikováno v:
IEEE Transactions on Circuits and Systems I: Regular Papers. :1-11
Publikováno v:
IEEE Journal of Solid-State Circuits. :1-12
Publikováno v:
2022 IEEE Asian Solid-State Circuits Conference (A-SSCC).
Publikováno v:
2022 IEEE Hot Chips 34 Symposium (HCS).
Publikováno v:
2022 20th IEEE Interregional NEWCAS Conference (NEWCAS).
Publikováno v:
2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS).
This paper conducts an in-depth analysis of crosstalk in a multi-hop inductive coupling interface for a 3D-stacked memory and proposes two countermeasures. The crosstalk among seven stacked dies is analyzed based on 3D electromagnetic (EM) simulation
Publikováno v:
ISCAS
This demonstration shows a high data rate, non-contact connector using a transmission line coupler (TLC) composed of two differential transmission lines. The TLC is an impedance-matched and wide-bandwidth coupler, therefore it enables the high-speed
Publikováno v:
IEICE Transactions on Fundamentals of Electronics, Communications and Computer Sciences. :2600-2606
Autor:
Satoshi Yamamoto, Yasunori Tamai, Takeshi Tsuka, Motoji Hata, Saburo Minami, Yoshiharu Okamoto, Masaki Hashida, Toshihiro Funatsu, Tomohiro Imagawa, Takahiro Takayama, Mitsuji Okada
Publikováno v:
Carbohydrate Polymers. 84:831-834
We have been investigating the effect of various amino sugars, uronic acid, and collagen peptides on wound healing of experimental cartilaginous tissue damage using a rabbit model, and also testing such supplements in various of diseases in dogs and