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Autor:
Rajaguru, P., Bailey, Christopher, Aliyu, Attahir Murtala, Castellazzi, Alberto, Pathirana, V., Udugampola, N., Trajkovic, T., Udrea, F., Mitchelson, P.D., Elliot, A.D.T.
Publikováno v:
IndraStra Global.
This paper details a co-design and modelling methodology to optimise the flip-chip assembly parameters so that the overall package and system meets performance and reliability specifications for LED lighting applications. A co-design methodology is e
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=issn23813652::94a8eb9851d453f436e789021a0b741b
https://igi.indrastra.com/items/show/20865
https://igi.indrastra.com/items/show/20865
