Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Mitchell D. Heins"'
Autor:
Robert Pack, Mitchell D. Heins, Victor V. Boksha, James Hogan, Bert Bruggeman, Christopher J. Progler, Ahmad Chatila
Publikováno v:
Design and Process Integration for Microelectronic Manufacturing III.
We consider modern design for manufacturing (DFM) as a manifestation of IC industry re-integration and intensive cost management dynamics. In that regard DFM is somewhat different from so-called design for yield (DFY) which essentially focuses on pro
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e972cc12ab775df9e194065690ec19a5
https://doi.org/10.1117/12.603077
https://doi.org/10.1117/12.603077
Autor:
T. Vucurevich, K. Shimasaki, Ahmad Chatila, M. Bales, Mitchell D. Heins, C. Neil Berglund, Victor Vladimir Boksha, F. James, J. Hogan, Robert C. Pack, D. Cottrell
Publikováno v:
SPIE Proceedings.
In this paper we review current design-to-silicon manufacturing challenges and complexities confronting the IC design and manufacturing worlds as the industry prepares for sub-100nm technology node IC production and discuss a simplifying infrastructu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::abbf83b05c696ad2a6520ab7f2b2067a
https://doi.org/10.1117/12.475667
https://doi.org/10.1117/12.475667
Autor:
David S. McCallum, Mitchell D. Heins, Jongwoo Kim, Peter S. Guilfoyle, Jinghui Mu, Milton Feng, Richard V. Stone, Wei-Heng Chang
Publikováno v:
SPIE Proceedings.
Optical interconnects provide wide bandwidth, lowloss, and high fanout as compared to those for traditional electrical interconnects. In the past years many high performance optoelectronic circuits have been demonstrated. However, most of them requir
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7428cc43b0dedf46540d3ed5532c3f0d
https://doi.org/10.1117/12.271104
https://doi.org/10.1117/12.271104