Zobrazeno 1 - 10
of 15
pro vyhledávání: '"Mirosław J. Kruszewski"'
Autor:
Izabela B. Zgłobicka, Anna Dobkowska, Aleksandra Zielińska, Ewa Borucinska, Mirosław J. Kruszewski, Rafał Zybała, Tomasz Płociński, Joanna Idaszek, Jakub Jaroszewicz, Krystian Paradowski, Bogusława Adamczyk-Cieślak, Kostiantyn Nikiforow, Bartosz Bucholc, Wojciech Święszkowski, Krzysztof J. Kurzydłowski
Publikováno v:
Journal of Magnesium and Alloys, Vol 11, Iss 8, Pp 2853-2871 (2023)
A novel metal matrix composites (MMC) with Mg matrix reinforced with natural filler in the form of Didymosphenia geminata frustules (algae with distinctive siliceous shells) are presented in this work. Pulse plasma sintering (PPS) was used to manufac
Externí odkaz:
https://doaj.org/article/78a4b98429724954a0b8353cab7d823d
Autor:
Bartosz Bucholc, Kamil Kaszyca, Piotr Śpiewak, Krzysztof Mars, Mirosław J. Kruszewski, Łukasz Ciupiński, Krystian Kowiorski, Rafał Zybała
Publikováno v:
Bulletin of the Polish Academy of Sciences: Technical Sciences, Vol 70, Iss 3 (2022)
Doping is one of the possible ways to significantly increase the thermoelectric properties of many different materials. It has been confirmed that by introducing bismuth atoms into Mg sites in the Mg2Si compound, it is possible to increase career con
Externí odkaz:
https://doaj.org/article/98d9c93605ea43b99b6fc2c6e9adacc3
Publikováno v:
Microelectronics International. 39:188-193
Purpose The purpose of this paper is to develop and test the thermal interface materials (TIM) for application in assembly of semiconductor chips to package. Good adhesion properties (>5 MPa shear strength) and low thermal interface resistance (bette
Publikováno v:
Materials Today: Proceedings. 44:3475-3482
Skutterudites are highly promising thermoelectric materials for mid-temperature range (400–850 K) applications because they exhibit one of the highest efficiencies of energy conversion at this temperature. It is well proven that skutterudite-based
Autor:
Mirosław J. Kruszewski, Andrzej Mikuła, Andrzej Koleżyński, Krzysztof Mars, Juliusz Leszczyński, Paweł Nieroda
Publikováno v:
Ceramics International. 46:25460-25466
Copper(I) sulphide is one of the most intensely studied superionic thermoelectric materials. High mobility of copper ions have positive impact on thermoelectric figure of merit, however it brings some stability drawbacks. In this work we compare ther
Publikováno v:
2021 44th International Spring Seminar on Electronics Technology (ISSE).
The paper aims to develop an assembly technique for the connection of bare Si or TiAu metallized Si chips to NiAu plated Cu surface. The thermal interface material (TIM) based on Ag paste was used for this purpose. It was found that Ag-based TIM allo
Autor:
Justyna Grzonka, Katarzyna Pietrzak, M. Schmidt, Łukasz Ciupiński, Rafał Zybała, Paulina Kamińska, Mirosław J. Kruszewski
Publikováno v:
Materials Today: Proceedings. 5:10316-10322
In this work, we present a new fabrication method of thermoelectric nanomaterials using Pulsed Plasma in Liquid (PPL) with a low-energy spark discharge. Thermoelectric (TE) materials can be used for direct energy conversion from heat into electricity
Autor:
Andrzej Michalski, Dorota Moszczyńska, Marcin Chmielewski, Łukasz Ciupiński, Mirosław J. Kruszewski, Justyna Grzonka, Radosław Zielińsk
Publikováno v:
Materials & Design, Vol 120, Iss, Pp 170-185 (2017)
To produce metal-diamond composite materials with high thermal conductivity, it is important for a high-quality carbide interface to exist between the metal matrix and diamond. The addition of carbide-forming elements to the matrix positively influen
Autor:
Rafał Zybała, Marcin Chmielewski, Krzysztof J. Kurzydłowski, M. Rajska, Łukasz Ciupiński, Mirosław J. Kruszewski, Andrzej Michalski, B. Adamczyk-Cieślak
Publikováno v:
Journal of Electronic Materials. 45:1369-1376
The use of the pulse plasma sintering technique for CoSb3 thermoelectric material consolidation is reported in this work. The influence of sintering temperature on the microstructure and material properties such as the Seebeck coefficient, electrical
Autor:
Mirosław J. Kruszewski, Krzysztof J. Kurzydłowski, Marta Mazurkiewicz, Łukasz Ciupiński, Andrey M. Abyzov, Andrzej Michalski
Publikováno v:
Materials & Design. 76:97-109
Diamond powder with an average particle size of 200 μm was coated with tungsten and tungsten carbide coatings of thickness 260 nm. Pulse Plasma Sintering (PPS) was then used to fabricate copper/diamond composites with a 1:1 volume ratio. The composi