Zobrazeno 1 - 10
of 25
pro vyhledávání: '"Mirko Bernardoni"'
Publikováno v:
2022 IEEE Workshop on Wide Bandgap Power Devices and Applications in Europe (WiPDA Europe).
Publikováno v:
IEEE Transactions on Power Electronics. 34:4703-4710
An innovative modeling methodology for the simulation of electrothermal interaction in power devices, based on neural networks (NNs), is shown. The suitability of NNs in modeling the complicated nonlinear, temperature dependent characteristic that po
Publikováno v:
e & i Elektrotechnik und Informationstechnik
OTP (One Time Programmable) memory in power technology enables electrical performance optimization together with area occupation reduction. In this paper, the aspects relative to the oxide breakdown (which is the key mechanism for memory programmabil
Publikováno v:
Microelectronics Reliability. :389-392
Due to the intrinsic piezoelectric nature of Gallium Nitride (GaN), devices manufactured with such technology are in principle prone to experience electro-mechanically induced resonance phenomena under operating conditions. In this paper, we present
Publikováno v:
Microelectronics Reliability. 80:223-229
In this work, a general methodology to extract compact, non-linear transient thermal models of complex thermal systems is presented and validated. The focus of the work is to show a robust method to develop compact and accurate non-linear thermal mod
Autor:
Marco Simonazzi, Nicola Delmonte, Roberto Menozzi, Paolo Cova, Danilo Santoro, Mirko Bernardoni
Publikováno v:
Microelectronics Reliability. 126:114324
In this work we present a system-simulation approach to model the behavior of PROFET™ devices for automotive applications. Attention has been paid to the simulation speed, given the necessity to simulate long mission profiles in a short amount of t
Publikováno v:
IEEE Transactions on Power Electronics. 32:561-570
We present a finite-element analysis of the coupled electro-thermal behavior of a mm $^2$ -sized power DMOS device, with a focus on resolving µm-sized structures. For a reliable power technology, the predictions of current and temperature distributi
Publikováno v:
Microelectronics Reliability. 58:126-132
In this paper, a simple method to describe the effect of Printed Circuit Board (PCB) and environment on the thermal behavior of packaged devices is addressed. This approach aims at exploiting the benefit of compact thermal models, which are necessari
Autor:
Marianne Mataln, Mirko Bernardoni, Florian Peter Pribahsnik, Michael Nelhiebel, Andreas Lindemann
Publikováno v:
IEEE Transactions on Power Electronics. :1-1
Due to the intrinsic piezoelectric nature of gallium nitride (GaN), devices manufactured with such technology are in principle prone to experience electromechanically induced resonance phenomena during cyclic switching operation. We will outline an a
Publikováno v:
The Review of scientific instruments. 88(2)
The curvature evolution of a thin film layer stack containing a top Al layer is measured during temperature cycles with very high heating rates. The temperature cycles are generated by means of programmable electrical power pulses applied to miniatur