Zobrazeno 1 - 10
of 36
pro vyhledávání: '"Minoru Ueshima"'
Autor:
Koji S. Nakayama, Masahiko Nishijima, Yicheng Zhang, Chuantong Chen, Minoru Ueshima, Katsuaki Suganuma
Publikováno v:
Scientific Reports, Vol 14, Iss 1, Pp 1-9 (2024)
Abstract Metastable phases such as supersaturated solid solutions, supercooling, and amorphous phases are well-known in metallurgy. They are often composed in non-equilibrium states and can be transformed into a stable phase by overcoming an energy b
Externí odkaz:
https://doaj.org/article/988515a54ba14cc1a8fbd5b39549cabc
Autor:
Yuxin Xu, Xiaoming Qiu, Wangyun Li, Suyu Wang, Ninshu Ma, Minoru Ueshima, Chuantong Chen, Katsuaki Suganuma
Publikováno v:
Journal of Materials Research and Technology, Vol 26, Iss , Pp 1079-1093 (2023)
Diamond has the highest thermal conductivity among naturally occurring materials and a relatively low coefficient of thermal expansion (CTE), making it a promising interconnected material for next-generation semiconductor power devices. In this study
Externí odkaz:
https://doaj.org/article/ae4c6e2d42d34e71bc6222002db58b1e
Autor:
Yang Liu, Chuantong Chen, Zheng Zhang, Minoru Ueshima, Takeshi Sakamoto, Takuya Naoe, Hiroshi Nishikawa, Yukinori Oda, Katsuaki Suganuma
Publikováno v:
Materials & Design, Vol 224, Iss , Pp 111389- (2022)
Aiming for a suitable die-attached substrate for Ag-sintered joint technology during harsh operating environment, three surface finishes of sputtered Ti/Ag- layers, electroless Ni-/Pt-/Ag- layers, and electroplated Ni-/electroless Ni-/Pt-/Ag- layers
Externí odkaz:
https://doaj.org/article/fb208224d8384035a9ee4f3d159a71d1
Publikováno v:
2023 International Conference on Electronics Packaging (ICEP).
Publikováno v:
2023 International Conference on Electronics Packaging (ICEP).
Publikováno v:
2023 International Conference on Electronics Packaging (ICEP).
Autor:
Shuaijie Zhao, Chuantong Chen, Motoharu Haga, Minoru Ueshima, Hidetoshi Hirahara, Jing Sang, Sung hun Cho, Tohru Sekino, Katsuaki Suganuma
Publikováno v:
Composites Part B: Engineering. 254:110562
Publikováno v:
2022 International Conference on Electronics Packaging (ICEP).
Autor:
Yang Liu, Chuantong Chen, Katsuaki Suganuma, Takeshi Sakamoto, Minoru Ueshima, Takuya Naoe, Hiroshi Nishikawa
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Publikováno v:
Applied Surface Science. 608:155165