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pro vyhledávání: '"Minoru Fukuomori"'
Autor:
Shimizu Koji, Keiji Toda, Kazuhiro Tsuruta, Naoki Kawanabe, Tomonori Iizuka, Masayuki Hikita, Rikiya Kamimura, Nobuaki Sato, Keiko Wada, Isamu Morisako, Kazuhiko Sugiura, Kazutoshi Ueda, Kohei Tatsumi, Minoru Fukuomori
Publikováno v:
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
New bonding technologies, which can deliver high-temperature thermal resistance that replaces solder bonding or Al wire bonding, have been strongly expected in order to maximize the performance of SiC power device. Aiming for application to the inver