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pro vyhledávání: '"Minjun Ai"'
Autor:
Minjun Ai, Yuzhu Song, Feixiang Long, Yuanpeng Zhang, Ke An, Dunji Yu, Yan Chen, Yuki Sakai, Masahito Ikeda, Kazuki Takahashi, Masaki Azuma, Naike Shi, Chang Zhou, Jun Chen
Publikováno v:
Advanced Science, Vol 11, Iss 40, Pp n/a-n/a (2024)
Abstract Rapid advancements in electronic devices yield an urgent demand for high‐performance electronic packaging materials with high thermal conductivity, low thermal expansion, and great mechanical properties. However, it is a great challenge fo
Externí odkaz:
https://doaj.org/article/df3aa974cfeb458bb2ff3dfa7d12c70d
