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Publikováno v:
2019 30th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC).
Optimizing NF 3 cleaning is crucial in minimizing defects seen in the process. In this paper, we took a different approach to maximize particle reduction using both conventional and non- conventional endpointing methods. Cleaning indicators, typicall
Publikováno v:
2019 30th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC).
This work explored the formation of Copper Bridge (Cu BG) defects with wafer center signature which is one of the key defect types in VLSI IC device fabrication and can result in high yield loss. Defect transition analysis and transmission electron m