Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Minho Gim"'
Publikováno v:
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::15ecf18421746b5259f69e72de399b36
https://doi.org/10.1109/eptc56328.2022.10013158
https://doi.org/10.1109/eptc56328.2022.10013158
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::419336d3898c5d25d9d65770dc8db211
https://doi.org/10.1109/ectc51906.2022.00313
https://doi.org/10.1109/ectc51906.2022.00313
Autor:
ChoongHoe Kim, Choonheung Lee, Jin Young Kim, Yanggyoo Jung, Yunseok Song, DongSu Ryu, Minho Gim, Juhoon Yoon
Publikováno v:
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
Conventional flip chip technologies such as the mass reflow (MR) process and the thermal compression bonding (TCB) process are commonly used technologies in the micro assembly field. However, there is a continuous need for next generation interconnec
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::26a8b667c8bbaa76280019efe6534098
https://doi.org/10.1109/ectc.2016.76
https://doi.org/10.1109/ectc.2016.76