Zobrazeno 1 - 10
of 36
pro vyhledávání: '"Mingjun Yao"'
Publikováno v:
Frontiers in Immunology, Vol 15 (2024)
As an effective treatment for diabetes, islet transplantation has garnered significant attention and research in recent years. However, immune rejection and the toxicity of immunosuppressive drugs remain critical factors influencing the success of is
Externí odkaz:
https://doaj.org/article/5cbe76ed0e0243c9ac62999d15825d34
Publikováno v:
Journal of Food Protection. 83:365-376
The effects of different grilling methods and tea marinades on the formation of heterocyclic amines (HCAs) and benzo[a]pyrene (BaP) in grilled chicken drumsticks were investigated. This study showed that both the grilling method and type of charcoal
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::dc7cd5df74128b8c604d19d540afeba1
https://doi.org/10.4315/0362-028x.jfp-19-084
https://doi.org/10.4315/0362-028x.jfp-19-084
Autor:
Zhou Xinghu, Suhong Huang, Zongshuai Zhu, Ming Huang, Yiqun Cheng, Yang Lei, Iftikhar Ali Khan, Mingjun Yao
Publikováno v:
Journal of Food Protection. 82:2154-2160
The objective of this work was to investigate the effects of pan frying on the formation of two typical advanced glycation end products (AGEs) named Nϵ-carboxymethyllysine (CML) and Nϵ-carboxyethyllysine (CEL) in prepared chicken breast. The marina
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::28b1a9e9e481bd66b9572d1d665a66a8
https://doi.org/10.4315/0362-028x.jfp-19-319
https://doi.org/10.4315/0362-028x.jfp-19-319
Publikováno v:
Communications in Statistics - Theory and Methods. 49:2990-3009
This paper investigates the first-order random coefficient integer valued autoregressive process with the occasional level shift random noise based on dual empirical likelihood. The limiting distri...
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::43473dc991eba183be4c877f9591704b
https://doi.org/10.1080/03610926.2019.1584315
https://doi.org/10.1080/03610926.2019.1584315
Publikováno v:
Manufacturing in the Era of 4th Industrial Revolution
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e5e9b86e058d390a40a4e1d66278f247
https://doi.org/10.1142/9789811222863_0008
https://doi.org/10.1142/9789811222863_0008
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 8:1855-1862
A low-temperature wafer-level hybrid bonding process using micro Cu pillar solder bumps and photopatternable dry film adhesive is developed and investigated, where the microbumps and dry film adhesive are simultaneously bonded at a low temperature of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e15f90275cbb862ab2f9de2f8dc1ccfc
https://doi.org/10.1109/tcpmt.2018.2837118
https://doi.org/10.1109/tcpmt.2018.2837118
Publikováno v:
Journal of Electronic Materials. 47:7544-7557
Three-dimensional (3-D) small chip stacking using low cost wafer-level insert-bump hybrid bonding and via-last TSVs is proposed and investigated. The proposed hybrid bonding method realized by micro Cu pillar solder bumps and photo-patternable B-stag
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c3659523a17a1374fde0fb47c024d98a
https://doi.org/10.1007/s11664-018-6701-z
https://doi.org/10.1007/s11664-018-6701-z
Publikováno v:
Journal of Materials Science: Materials in Electronics. 28:9091-9095
A simplified low-temperature wafer-level hybrid bonding process using Cu pillar bumps and photosensitive adhesive was reported, wherein Cu/SnAg/Ni–P micro interconnects were formed to achieve electrical interconnect and the sealing around adhesive
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::35c314dd145a15fdee451b59f6289b06
https://doi.org/10.1007/s10854-017-6642-y
https://doi.org/10.1007/s10854-017-6642-y
Publikováno v:
Journal of Materials Science: Materials in Electronics. 28:8824-8831
Fluorescence X-ray Absorption Fine Structure (XAFS) was used to in situ study the local structure around Cu atoms in liquid Sn solder during Sn/Cu liquid–solid interfacial reaction. The extended edge data were analyzed by cumulant expansion method.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b91b9c47b455fb2ebca39d6261001eea
https://doi.org/10.1007/s10854-017-6610-6
https://doi.org/10.1007/s10854-017-6610-6
Publikováno v:
Microsystem Technologies. 23:4879-4889
3D wafer-level chip scale packaging (3D WLCSP) using via last through silicon via (TSV) technology is an ideal technology to meet small-form-factor, high I/O density, high-speed, short time to market and lower cost product requirements. In this study
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3f1d53d556734568d1a63b71add3c07c
https://doi.org/10.1007/s00542-016-3267-7
https://doi.org/10.1007/s00542-016-3267-7