Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Mingdi Ding"'
Autor:
Difei Bian, Mingdi Ding, Hongjuan Huang, Longjie Huang, Desheng Zhao, Yong Cai, Yunzhen Lin, Baoshun Zhang, Yibin Zhang
Publikováno v:
IEEE Transactions on Electron Devices. 65:564-571
A 2-D thermal-electric coupling model has been developed, which enables us to evaluate the current distribution of monolithically integrated light-emitting diode (MI-LED). Based on the experimental IR images, the current distributions have been evalu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7c4b379ae641a22bfa34d3eead0849fa
https://doi.org/10.1109/ted.2017.2783622
https://doi.org/10.1109/ted.2017.2783622
Autor:
Hongjuan Huang, Yibin Zhang, Desheng Zhao, Jianwei Xu, Mingdi Ding, Yundong Qi, Yong Cai, Baoshun Zhang, Zhenlin Miao, Guojun Lu
Publikováno v:
IEEE Electron Device Letters. 37:197-200
A simplified packaging process was successfully developed for a wafer-level light emitting diode (WL-LED) chip aiming at very-high power solid-state lighting (SSL) applications. Compared with the traditional chip-on-board (COB) technology, WL-LED chi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::38e7c26abd4178d2c28a9be83034c9be
https://doi.org/10.1109/led.2015.2509462
https://doi.org/10.1109/led.2015.2509462
Autor:
Yibin Zhang1,2, Mingdi Ding1,3, Desheng Zhao4, Hongjuan Huang4, Baoshun Zhang4, Yong Cai4, Longjie Huang5, Yunzhen Lin5, Difei Bian5
Publikováno v:
IEEE Transactions on Electron Devices. Feb2018, Vol. 65 Issue 2, p564-571. 8p.
Autor:
Peng He, Yibin Zhang, Hongjuan Huang, Xin Xu, Baoshun Zhang, Desheng Zhao, Jianwei Xu, Yanming Wang, Yongjun Dong, Yong Cai, Zhenlin Miao, Mingdi Ding
Publikováno v:
Electronics Letters. 52:2050-2051
A high-power phosphor-converted white LED with 3058 lm is reported. The high-power white LED was manufactured by utilising a single-blue LED chip with a cerium-doped yttrium aluminium garnet phosphor crystal film, and the LED chip consists of 16 LED
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5b2830ba18649367d55203e49ab44627
https://doi.org/10.1049/el.2016.2789
https://doi.org/10.1049/el.2016.2789
Autor:
Mingdi Ding1,2 mdding2014@sinano.ac.cn, Yibin Zhang1,3, Jianwei Xu1,2, Desheng Zhao1, Hongjuan Huang1, Xin Xu2, Zhenlin Miao4, Peng He4, Yanming Wang4, Yongjun Dong5, Baoshun Zhang1, Yong Cai1
Publikováno v:
Electronics Letters (Wiley-Blackwell). 12/8/2016, Vol. 52 Issue 25, p2050-2051. 2p. 1 Diagram, 3 Graphs.