Zobrazeno 1 - 10
of 54
pro vyhledávání: '"Mingche Lai"'
Autor:
Min Tan, Jiang Xu, Siyang Liu, Junbo Feng, Hua Zhang, Chaonan Yao, Shixi Chen, Hangyu Guo, Gengshi Han, Zhanhao Wen, Bao Chen, Yu He, Xuqiang Zheng, Da Ming, Yaowen Tu, Qiang Fu, Nan Qi, Dan Li, Li Geng, Song Wen, Fenghe Yang, Huimin He, Fengman Liu, Haiyun Xue, Yuhang Wang, Ciyuan Qiu, Guangcan Mi, Yanbo Li, Tianhai Chang, Mingche Lai, Luo Zhang, Qinfen Hao, Mengyuan Qin
Publikováno v:
Frontiers of Optoelectronics, Vol 16, Iss 1, Pp 1-40 (2023)
Abstract Due to the rise of 5G, IoT, AI, and high-performance computing applications, datacenter traffic has grown at a compound annual growth rate of nearly 30%. Furthermore, nearly three-fourths of the datacenter traffic resides within datacenters.
Externí odkaz:
https://doaj.org/article/9529bc90f9b94b018291e0d3dc8bad29
Autor:
Geng Zhang, Mingche Lai, Fangxu Lyu, Xuqiang Zheng, Heming Wang, Dongbin Lv, Chaolong Xu, Xingyun Qi, Qing Liu
Publikováno v:
IEEE Access, Vol 10, Pp 96556-96567 (2022)
A novel high-speed transceiver based on 7 bit correlated non-return-to-zero(CNRZ-7) with high-bandwidth-density(bandwidth per unit length) and low-power for Die-to-Die(D2D) communication is proposed. In order to further improve the SNR and the bandwi
Externí odkaz:
https://doaj.org/article/4e62ef0d5b0546e3b0c070e2dae73b9a
Publikováno v:
Journal of Computer Networks and Communications, Vol 2018 (2018)
The demand from exascale computing has made the design of high-radix switch chips an attractive and challenging research field in EHPC (exascale high-performance computing). The static power, due to the thermal sensitivity and process variation of th
Externí odkaz:
https://doaj.org/article/9c2a4b95d3294f0f9f427fcf9f961c1d
Publikováno v:
2022 IEEE 24th Int Conf on High Performance Computing & Communications; 8th Int Conf on Data Science & Systems; 20th Int Conf on Smart City; 8th Int Conf on Dependability in Sensor, Cloud & Big Data Systems & Application (HPCC/DSS/SmartCity/DependSys).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::12361092eb78b8c6111a6d52219fa063
https://doi.org/10.1109/hpcc-dss-smartcity-dependsys57074.2022.00087
https://doi.org/10.1109/hpcc-dss-smartcity-dependsys57074.2022.00087
Publikováno v:
2022 7th International Conference on Integrated Circuits and Microsystems (ICICM).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4ccbe1a4316a1d08fa1615328414b557
https://doi.org/10.1109/icicm56102.2022.10011357
https://doi.org/10.1109/icicm56102.2022.10011357
Publikováno v:
Optics express. 30(15)
Electrical crosstalk severely degrades the performance of Mach-Zehnder modulator (MZM) array. However, conventional crosstalk suppression techniques incur losses of large amounts of chip area for signal isolation, which becomes a bottleneck of high-d
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::41732bd338ba6a02c9d086dc3d5be25d
https://pubmed.ncbi.nlm.nih.gov/36236907
https://pubmed.ncbi.nlm.nih.gov/36236907
Publikováno v:
Electronics; Volume 11; Issue 18; Pages: 2864
This paper proposes a multichannel and high-bandwidth (BW) receiver for standard packaging die-to-die (D2D) interconnects. The receiver adopts forward clock (FCK) architecture of the high-density transmission standard, which consists of 16 high-speed
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::49ee150e18736b3848b311b9e75da64d
Publikováno v:
Lecture Notes in Computer Science ISBN: 9783031213946
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5980b434af043f2d953da2f4e0cb82b5
https://doi.org/10.1007/978-3-031-21395-3_30
https://doi.org/10.1007/978-3-031-21395-3_30
Autor:
Mingche Lai, Geng Zhang, Fangxu Lv, Xuqiang Zheng, Heming Wang, Dongbin Lv, Chaolong Xu, Xingyun Qi
Publikováno v:
Microelectronics Journal. 130:105628
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::57aebe72d15d5be6e750da6d3969eed1
https://doi.org/10.1016/j.mejo.2022.105628
https://doi.org/10.1016/j.mejo.2022.105628
Autor:
Miaomiao Wu, Mingche Lai, Fangxu Lv, Jianjun Shi, Heming Wang, Zheng Wang, Zixiang Tang, Chaolong Xu
Publikováno v:
2021 6th International Conference on Integrated Circuits and Microsystems (ICICM).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::122cc53f6ad3c53e20aa45b2b5b25d10
https://doi.org/10.1109/icicm54364.2021.9660321
https://doi.org/10.1109/icicm54364.2021.9660321