Zobrazeno 1 - 10
of 14
pro vyhledávání: '"Ming-yue Xiong"'
Publikováno v:
Science and Technology of Advanced Materials, Vol 20, Iss 1, Pp 421-444 (2019)
With the development of lead-free solders in electronic packaging, Sn-Cu lead-free solder has attracted wide attention due to its excellent comprehensive performance and low cost. In this article, we present recent developments in Sn-Cu lead-free sol
Externí odkaz:
https://doaj.org/article/49b2e7c58c3244c0983f1912552d4cf3
Autor:
Nan Jiang, Liang Zhang, Zhi-Quan Liu, Lei Sun, Wei-Min Long, Peng He, Ming-Yue Xiong, Meng Zhao
Publikováno v:
Science and Technology of Advanced Materials, Vol 20, Iss 1, Pp 876-901 (2019)
Electronic products are evolving towards miniaturization, high integration, and multi-function, which undoubtedly puts forward higher requirements for the reliability of solder joints in electronic packaging. Approximately 70% of failure in electroni
Externí odkaz:
https://doaj.org/article/67223ea7164e4f1e83a427074f4399fd
Publikováno v:
MATERIALS TRANSACTIONS. 61:718-722
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::498753187ba683263618ca35fa0876f0
https://doi.org/10.2320/matertrans.mt-m2019369
https://doi.org/10.2320/matertrans.mt-m2019369
Autor:
Lei Sun, Ming-yue Xiong, Long Weimin, Meng Zhao, Nan Jiang, Zhi-Quan Liu, Peng He, Liang Zhang
Publikováno v:
Science and Technology of Advanced Materials, Vol 20, Iss 1, Pp 876-901 (2019)
Science and Technology of Advanced Materials
Science and Technology of Advanced Materials
Electronic products are evolving towards miniaturization, high integration, and multi-function, which undoubtedly puts forward higher requirements for the reliability of solder joints in electronic packaging. Approximately 70% of failure in electroni
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::d494f519ca035125ad58abf148516eee
https://doaj.org/article/67223ea7164e4f1e83a427074f4399fd
https://doaj.org/article/67223ea7164e4f1e83a427074f4399fd
Publikováno v:
Vacuum. 167:301-306
In order to reduce the formation of voids in the Cu/Sn58Bi/Cu solder joints during transient liquid phase (TLP) bonding, the effect of CuZnAl particles on microstructure of Cu/SnBi/Cu TLP bonding solder joints was investigated. After bonding, the pri
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::50e2b68b52da114f0806cd79c038f17f
https://doi.org/10.1016/j.vacuum.2019.06.024
https://doi.org/10.1016/j.vacuum.2019.06.024
Publikováno v:
Journal of Materials Science: Materials in Electronics. 30:17583-17590
In this paper, the influences of adding Titanium (Ti) nanoparticles on melting characteristics, wettability, shear properties and the growth of interfacial intermetallic compounds (IMC) of Sn58Bi solder were investigated. The results show that the ad
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ce8b353a01d22f852af91cab48857fe8
https://doi.org/10.1007/s10854-019-02107-0
https://doi.org/10.1007/s10854-019-02107-0
Publikováno v:
Soldering & Surface Mount Technology. 32:42-47
Purpose The transistor circuit based on Moore's Law is approaching the performance limit. The three-dimensional integrated circuit (3-D IC) is an important way to implement More than Moore. The main problems in the development of 3-D IC are Joule hea
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a62cce2762b43cb709dca49b0d976c5b
https://doi.org/10.1108/ssmt-04-2019-0016
https://doi.org/10.1108/ssmt-04-2019-0016
Publikováno v:
Journal of Materials Science: Materials in Electronics. 30:15054-15063
With the purpose of improving the properties of the Sn–3.8Ag–0.7Cu lead-free solder 0.5 wt% micro-CuZnAl particles were added. The experimental results showed that CuZnAl particles had little effect on the melting characteristics of Sn–3.8Ag–
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::46637e8146d7acacef7e2842a2d282bc
https://doi.org/10.1007/s10854-019-01878-w
https://doi.org/10.1007/s10854-019-01878-w
Autor:
Zhi Ning Huang, Dong Hong Deng, Guan Ye Nai, Ming Yue Xiong, Yan Huang, Si Nian Li, Jie Wei, Xiang You Yao, Xun Jun Huang, Peng Cheng, Weijie Zhou, Yi Dai
Publikováno v:
Ann Transl Med
BACKGROUND: Acute myeloid leukemia (AML) is the most common hematological malignancy in adult patients. Ferroptosis-related signatures have been shown to act as regulators of the progression of multiple cancer types, but the role of ferroptosis in AM
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::5836248ba45cd6cda696679c6b9e2634
https://pubmed.ncbi.nlm.nih.gov/34733933
https://pubmed.ncbi.nlm.nih.gov/34733933
Autor:
Ming-yue Xiong, Liang Zhang
Publikováno v:
Journal of Materials Science. 54:1741-1768
During soldering and service, intermetallic compounds (IMCs) have an important impact on the performance and reliability of electronic products. A thin and continuous intermetallic layer facilitates the formation of reliable solder joints and improve
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6677288d3aa321d8b6d2d5a314f681f0
https://doi.org/10.1007/s10853-018-2907-y
https://doi.org/10.1007/s10853-018-2907-y