Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Ming-Kan Liang"'
Autor:
null Chun-Kai, null Liu, Yu-Lin Chao, June-Chien Chang, Wei Li, Chih-Ming Tzeng, Rong-Chang Fang, Kuo-Shu Kao, Tao-Chih Chang, Chang-Sheng Chen, Ming-Kan Liang, Wei-Chung Lo
Publikováno v:
2013 4th IEEE International Symposium on Power Electronics for Distributed Generation Systems (PEDG).
Insulated gate bipolar transistor (IGBT) power modules are widely used in household, industry and vehicle applications due to the features of higher efficiency, smaller size, low cost and higher reliability. However, the large power dissipation of IG
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::eaba2ceb20e7100701c9849a90e3afad
https://doi.org/10.1109/pedg.2013.6785626
https://doi.org/10.1109/pedg.2013.6785626
Publikováno v:
2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
A method for breaking a through-silicon-via (TSV) and forming a clean cross-section is investigated. We use focus-ion-beam (FIB) and diamond saw to create the notches that induce the crack passing through TSV precisely. Bending the sample with two si
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ada34467964d7661d633a69c98b98b4a
https://doi.org/10.1109/impact.2012.6420293
https://doi.org/10.1109/impact.2012.6420293
Publikováno v:
2012 7th International Microsystems, Packaging, Assembly & Circuits Technology Conference (IMPACT); 1/ 1/2012, p284-286, 3p