Zobrazeno 1 - 10
of 74
pro vyhledávání: '"Ming-C. Cheng"'
Autor:
Ming-C. Cheng
Publikováno v:
AIP Advances, Vol 10, Iss 11, Pp 115305-115305-15 (2020)
An effective multi-element simulation methodology for quantum eigenvalue problems is investigated. The approach is derived from a reduced-order model based on a data-driven learning algorithm, together with the concept of domain decomposition. The ap
Externí odkaz:
https://doaj.org/article/fdc5bee195d44a3fa85010b2f7e93db5
Autor:
Ming-C. Cheng
Publikováno v:
AIP Advances, Vol 6, Iss 9, Pp 095121-095121-16 (2016)
A reduced-order-based representation of the Schrödinger equation is investigated for electron wave functions in semiconductor nanostructures. In this representation, the Schrödinger equation is projected onto an eigenspace described by a small numb
Externí odkaz:
https://doaj.org/article/134d9884732b44a7ab944f246813992a
A thermal simulation methodology derived from the proper orthogonal decomposition (POD) and the Galerkin projection (GP), hereafter referred to as PODTherm-GP, is evaluated in terms of its efficiency and accuracy in a multi-core CPU. The GP projects
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::a8d5c5ffffce739182ee97b9317a2afc
Publikováno v:
Proceedings of the Platform for Advanced Scientific Computing Conference.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::faf1c403208fbc514a2ab6cdc8220eb1
https://doi.org/10.1145/3539781.3539799
https://doi.org/10.1145/3539781.3539799
Publikováno v:
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4e8ab92b440d050599bdadf59053ddb9
https://doi.org/10.1109/itherm54085.2022.9899503
https://doi.org/10.1109/itherm54085.2022.9899503
Publikováno v:
2022 IEEE International Symposium on Circuits and Systems (ISCAS).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6077ecacaf297b73bffeee1c2585f0b5
https://doi.org/10.1109/iscas48785.2022.9937274
https://doi.org/10.1109/iscas48785.2022.9937274
Autor:
Ming-C. Cheng, Wangkun Jia
Publikováno v:
2021 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD).
An approach combining domain decomposition and model order reduction enabled by a data-driving learning algorithm is developed for thermal simulation of interconnects. The approach accounts for variations of heat sources, boundary conditions (BCs) an
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::637fb04c6d3b8de92445fbc64e152884
https://doi.org/10.1109/sispad54002.2021.9592588
https://doi.org/10.1109/sispad54002.2021.9592588
Publikováno v:
2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm).
A data-driven reduced-order approach is applied to develop a thermal simulation model for a quad-core CPU, AMD ATHLON II X4 610e. The model is based on proper orthogonal decomposition (POD) that projects the physical domain of the CPU onto a function
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f4f6bebc21bbde2d589b1f007eed1bce
https://doi.org/10.1109/itherm51669.2021.9503183
https://doi.org/10.1109/itherm51669.2021.9503183
Autor:
Wangkun Jia, Ming-C. Cheng
A thermal simulation methodology is developed for interconnects enabled by a data-driven learning algorithm accounting for variations of material properties, heat sources and boundary conditions (BCs). The methodology is based on the concepts of mode
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::a6a2bada48c4bb65b76d107d1e309828
Publikováno v:
2020 IEEE MIT Undergraduate Research Technology Conference (URTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::873195b6b10fe04cd9643c3a249a5c69
https://doi.org/10.1109/urtc51696.2020.9668879
https://doi.org/10.1109/urtc51696.2020.9668879