Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Ming Jie Dai"'
Publikováno v:
Advanced Materials Research. :981-987
Based on the thermodynamic calculation, the reductants to reduce V2O5 were selected, 0.1% V were added into steels by reducing V2O5 during the smelting process. The yielding rate of vanadium was calculated by chemical analysis data. The yielding rate
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::27060ab5a4293de3c2b2a2e4318f43ea
https://doi.org/10.4028/www.scientific.net/amr.652-654.981
https://doi.org/10.4028/www.scientific.net/amr.652-654.981
Autor:
Shin-Yi Huang, Ming-Jie Dai, Wen-Luh Yang, Chin-Hao Yang, Tsong-Jen Yang, Chin-An Wang, Li-Min Lin, Fang-Tse Huang
Publikováno v:
ECS Transactions. 16:3-8
The Cu-Mn alloy films have been successfully fabricated by a novel chemical displacement process. The surface morphologies and displacement rate of Cu-Mn with pH values and temperatures are investigated in this paper. Furthermore, this chemical displ
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b582f490637cb324da0fb4e296f9d2b4
https://doi.org/10.1149/1.3114546
https://doi.org/10.1149/1.3114546
Autor:
Ming-Jie Dai, 戴明傑
96
For the 22 or 15nm generation technology, the CuMn alloy is a trend of interconnect. The advantages are “Self-form and reducing the via resistance”, the CuMn alloy is the key to form the self-formed diffusion barrier. As the CuMn alloy in
For the 22 or 15nm generation technology, the CuMn alloy is a trend of interconnect. The advantages are “Self-form and reducing the via resistance”, the CuMn alloy is the key to form the self-formed diffusion barrier. As the CuMn alloy in
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/68567039471311096043
