Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Ming Dak Chai"'
Autor:
Li Wern Chew, Ming Dak Chai
Publikováno v:
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b62b2c7976f393f9e6e70bc70e266adf
https://doi.org/10.1109/eptc56328.2022.10013176
https://doi.org/10.1109/eptc56328.2022.10013176
Publikováno v:
2022 International Conference on Electronics Packaging (ICEP).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b6d16e1a9ffa3d9fdac1f7c5b2b400e5
https://doi.org/10.23919/icep55381.2022.9795393
https://doi.org/10.23919/icep55381.2022.9795393
Publikováno v:
2015 6th Asia Symposium on Quality Electronic Design (ASQED).
Capacitance is very important in High Speed I/O power integrity network design. There are different form of capacitors being used on the High Speed I/O Power Integrity Network to ensure the performance of the circuit. In this paper, the effectiveness
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e0ee1b87bd4c16214530cacbbdd8205a
https://doi.org/10.1109/acqed.2015.7274010
https://doi.org/10.1109/acqed.2015.7274010
Publikováno v:
2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC).
Transistor process technology continues to develop, the die size is shrinking approximately 20% to 35% with the process scaling. It is beneficial as smaller die can fit into several of small electronic devices for instance microprocessor watch and sm
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8675f57f1f18b0ad6a198b61ba71f579
https://doi.org/10.1109/icep-iaac.2015.7111108
https://doi.org/10.1109/icep-iaac.2015.7111108