Zobrazeno 1 - 5
of 5
pro vyhledávání: '"MinKeon Lee"'
Publikováno v:
Aerospace, Vol 11, Iss 1, p 83 (2024)
Satellites have been developed and operated for various purposes. The global satellite market is growing rapidly as the number of satellites and their mission diversity increase. Satellites revolve around the Earth to perform missions and communicate
Externí odkaz:
https://doaj.org/article/54f1e56f60c94ba4a6affe65ffe898f9
Effect of the Fiber Orientation and the Radial Depth of Cut on the Flank Wear in End Milling of CFRP
Publikováno v:
International Journal of Precision Engineering and Manufacturing. 21:1187-1199
In this study tool wear during CFRP milling is experimentally investigated to explore the optimization of various cutting condition. From the test machining, it was found that CFRP milling was conducted mostly through the brittle mode machining that
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::32ce48e87b2ed9a3863255f51e944381
https://doi.org/10.1007/s12541-020-00340-w
https://doi.org/10.1007/s12541-020-00340-w
Publikováno v:
The International Journal of Advanced Manufacturing Technology. 106:2433-2449
This study investigates the effect of a tool holder with a metallic damping alloy on both vibration reduction and surface finish improvement for use in an end-milling process. Two different configurations of damping alloys are designed: a collet and
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a4492fa827fb74da9b9b2eee5c0aad62
https://doi.org/10.1007/s00170-019-04757-0
https://doi.org/10.1007/s00170-019-04757-0
Autor:
MinKeon Lee, Dave Hiner, WonChul Do, Michael G. Kelly, GamHan Yong, MinSu Jeong, JiHun Lee, JinYoung Khim, JongHyun Jeon, Eun-Sook Sohn, DongHoon Han
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
Semiconductor products used in high-performance computing (HPC) and artificial intelligence (AI) applications require higher memory bandwidth, greater input/output (I/O) count, better power delivery network (PDN) performance and improved heat dissipa
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::179d2de13ea86592d2abd3c438a28051
https://doi.org/10.1109/ectc32696.2021.00027
https://doi.org/10.1109/ectc32696.2021.00027
Autor:
Ji Hun Lee, JaeYoon Kim, EunYoung Lee, KyeRyung Kim, WonChul Do, SeHwan Hong, MinKeon Lee, David Jon Hiner, JuHong Shin
Publikováno v:
2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC).
In this work, a hybrid 3D package combining a redistribution layer (RDL) and laminate substrate layer for ultra-thin and high-bandwidth mobile applications are discussed and demonstrated. The motivation behind this hybrid 3D package structure was lev
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7ba2ac072bfe121f3091f31cefecb76b
https://doi.org/10.1109/eptc50525.2020.9315082
https://doi.org/10.1109/eptc50525.2020.9315082