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Autor:
Young Chai Jung, ByoungHak Hong, Sung-young Lee, Duck Kyoon Ahn, Keun Hwi Cho, SuHeon Hong, Sungwoo Hwang, Min-Sang Kimc, Donggun Park, Dong-Won Kim, Eun-Jung Yoon
Publikováno v:
2007 International Semiconductor Device Research Symposium.
Recently, having vertically stacked arrays of 3D channels, multi-bridge-channel MOSFETs (MBCFETs) have been fabricated successfully (Lee et al., 2003). In this paper, we report temperature dependent transport characteristics of the MBCFET.