Zobrazeno 1 - 10
of 102
pro vyhledávání: '"Min-Bo Zhou"'
Publikováno v:
ACS Applied Electronic Materials. 3:4640-4648
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6ffc9de3302311b3b672a242de089478
https://doi.org/10.1021/acsaelm.1c00804
https://doi.org/10.1021/acsaelm.1c00804
Publikováno v:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1c99ecd10ac62bb20f334a5ff04340cc
https://doi.org/10.1109/icept56209.2022.9873390
https://doi.org/10.1109/icept56209.2022.9873390
Publikováno v:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::900420a62010b49528ba0cb01d8a8573
https://doi.org/10.1109/icept56209.2022.9873416
https://doi.org/10.1109/icept56209.2022.9873416
Publikováno v:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::aa9e3be9d781da7d9c56ef7cdba48459
https://doi.org/10.1109/icept56209.2022.9873147
https://doi.org/10.1109/icept56209.2022.9873147
Autor:
Hong-Guang Wang, Guang-Chao Lyu, Yun-Kai Deng, Wei-Lin Hu, Bing-Xian Yang, Min-Bo Zhou, Xin-Ping Zhang
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::48cb57d131a8785afc154f5bb7d8ab15
https://doi.org/10.1109/ectc51906.2022.00233
https://doi.org/10.1109/ectc51906.2022.00233
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::dcae4c5c9de922238fcc894630e44421
https://doi.org/10.1109/ectc51906.2022.00364
https://doi.org/10.1109/ectc51906.2022.00364
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::dc5c3b94a8f69d064aeeaf830bebf532
https://doi.org/10.1109/ectc51906.2022.00132
https://doi.org/10.1109/ectc51906.2022.00132
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0c7a9991a0b93f36ae1f320b7918e9d2
https://doi.org/10.1109/ectc51906.2022.00257
https://doi.org/10.1109/ectc51906.2022.00257
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::216c00dd4ce570afeeecfb195b6b66f0
https://doi.org/10.1109/ectc51906.2022.00325
https://doi.org/10.1109/ectc51906.2022.00325
Publikováno v:
2021 22nd International Conference on Electronic Packaging Technology (ICEPT).
In heterogeneous integration with three-dimensional (3D) packaging, solder joints are used in different levels of packages, which have a wide range of sizes, for instance, from hundreds of microns in BGA joints to a few tens of microns in micro-bump
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1fcfda5821c74ae4dbeb4520fa2de9be
https://doi.org/10.1109/icept52650.2021.9568180
https://doi.org/10.1109/icept52650.2021.9568180