Zobrazeno 1 - 1
of 1
pro vyhledávání: '"Millete Carino"'
Autor:
John C. Malinowski, Zhuo-Jie Wu, Kristina Young-Fisher, Patrick Justison, Jean Trewhella, Haojun Zhang, Millete Carino
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
The acceptance of Wafer Level Chip Scale Package (WLCSP) technology is significantly increasing for use in small devices such as mobile phones, wearable, RF antenna packages, and health monitor sensors. WLCSP structures can have a few thin redistribu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b9944ed9cb07942aad4a87b3dc6d09b9
https://doi.org/10.1109/ectc32862.2020.00335
https://doi.org/10.1109/ectc32862.2020.00335
