Zobrazeno 1 - 1
of 1
pro vyhledávání: '"Miller, Felix Reinhard"'
Autor:
Miller, Felix Reinhard
3D-ICs with through silicon vias (TSVs) allow multiplication of circuit capacities with constant area footprint. This dissertation covers the optimization of on-chip communication networks (NoCs) for 3D-ICs. A configurable circuit module for bundling
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od_______518::73afbaa5f2d77af08293845adcc1f557
https://mediatum.ub.tum.de/1379744
https://mediatum.ub.tum.de/1379744
