Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Milena Kiliszkiewicz"'
Publikováno v:
Soldering & Surface Mount Technology. 32:235-240
Purpose The purpose of this paper is to analyze the individual steps during the printing of capacitor structures. The method of substrate preparation, the obtained roughness of conductive and dielectric layers are examined. Moreover, the capacitances
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::31eaaff973cd750743c4c6a324b83557
https://doi.org/10.1108/ssmt-11-2019-0039
https://doi.org/10.1108/ssmt-11-2019-0039
Publikováno v:
Circuit World. 46:301-306
Purpose The main purpose of this study is to test the performance of the ink-jet printed microwave resonant circuits on Low temperature co-fired ceramics (LTCC) substrates combined with microfluidic channels for sensor applications. Normally, conduct
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fd09251d6613b665aed74201ad668067
https://doi.org/10.1108/cw-11-2019-0176
https://doi.org/10.1108/cw-11-2019-0176
Autor:
Kamil Gorzka, Krzysztof Stojek, Tomasz Falat, Milena Kiliszkiewicz, Danylo Lizanets, Jan Felba
Publikováno v:
2019 42nd International Spring Seminar on Electronics Technology (ISSE).
Research goal was to detect defects and imperfections of sintered silver layer at thermal joints. Such defects may influence the contact area which lower mechanical strength of the joint with the usual consequence of reducing the heat flow between jo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3ab9a71e47c73d5779bc0159400c8d47
https://doi.org/10.1109/isse.2019.8810178
https://doi.org/10.1109/isse.2019.8810178
Autor:
Krzysztof Szostak, Milena Kiliszkiewicz, Laura Jasinska, Piotr Slobodzian, Ryszard Korbutowicz, Karol Malecha
Publikováno v:
2019 Conference on Microwave Techniques (COMITE).
In this paper we compare the influence of two printing techniques on wideband performance of a microstrip line on LTCC substrate. The inkjet printing and screen printing techniques are compared. The quality of conductive layers is analyzed in terms o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::529b63936241c452a773448fca5d9769
https://doi.org/10.1109/comite.2019.8733512
https://doi.org/10.1109/comite.2019.8733512
Publikováno v:
2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition.
The materials and technology parameters impact on mechanical properties for non-metalized silver-based joints made by low-temperature and low-pressure sintered Si surface with using silver nanoparticles is presented. The research approach based on su
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6514c8d5e65b06aa6554cc717874f0e4
https://doi.org/10.23919/empc.2017.8346924
https://doi.org/10.23919/empc.2017.8346924