Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Mikjaniec Travis S"'
Publikováno v:
2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm).
The thermal simulation of electronics modules have long been used to accelerate the design process by reducing the requirement of building and testing physical prototypes. Thermal simulation is used to determine the best design based on constraints s
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cf395fed17c3221501c91c33f64dd396
https://doi.org/10.1109/itherm51669.2021.9503248
https://doi.org/10.1109/itherm51669.2021.9503248
Autor:
Mikjaniec Travis S, Ke Pan, Jiefeng Xu, Junbo Yang, Seungbae Park, Yangyang Lai, Stephen R. Cain
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
All electronic packages will induce excess heat during usage and heat dissipation methods were developed to remove spare heat from the die in order to improve reliability. Thermal interface materials (TIMs) are one of the key solutions to decrease th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::05147fead1f483899587f87e2e009573
https://doi.org/10.1109/ectc32696.2021.00312
https://doi.org/10.1109/ectc32696.2021.00312