Zobrazeno 1 - 10
of 27
pro vyhledávání: '"Mikihiro Kashio"'
Publikováno v:
SID Symposium Digest of Technical Papers. 48:1750-1753
Publikováno v:
SID Symposium Digest of Technical Papers. 48:441-444
We demonstrated thermal curing encapsulation adhesive sheets for the flexible organic light emitting diodes. The thermal curing adhesive sheets were newly designed for the face-sealing encapsulation sheet and had sufficient interface adhesion between
Publikováno v:
KOBUNSHI RONBUNSHU. 72:48-56
Publikováno v:
Polymer Journal. 44:1214-1221
Polysilsesquioxanes (PSQs) containing 4-chloromethylphenyl groups were prepared and used for introducing ethylxanthate groups. The obtained PSQs that contained benzyl xanthate structures (XAPSQs) were employed as macroinitiators for grafting acrylami
Publikováno v:
Journal of The Adhesion Society of Japan. 48:341-347
Autor:
Shin-ichi Yamamoto, Yorihisa Tanaka, Toshio Sugizaki, Osamu Moriya, Mikihiro Kashio, Tadatomi Nishikubo
Publikováno v:
Polymer Journal. 43:525-530
The polysilsesquioxane (PSQ) containing 3-aminopropyl and phenyl groups (APSQ) was prepared from the corresponding trimethoxysilanes by co-condensation under basic conditions. The amino groups on APSQ were used as the initiator species for the graft
Publikováno v:
Journal of The Adhesion Society of Japan. 47:335-343
Publikováno v:
Polymer Journal. 42:313-318
A polysilsesquioxane with a bis(2-methoxyethyl)amide group and 15-crown-5-ether ring (MCPSQ) was newly prepared by the co-condensation of silane coupling reagents, which were obtained from (3-isocyanatopropyl)triethoxysilane and the corresponding ami
Autor:
Osamu Moriya, Toshio Sugizaki, Genki Honjou, Mikihiro Kashio, Hiroyuki Takushima, Shin-Ichi Yamamoto
Publikováno v:
Polymer Journal. 42:190-194
A methacrylate monomer, having an N-(2-methoxyethyl)methylamino group and urea bond, was newly prepared. The methacrylate monomer was used for graft polymerization from polysilsesquioxane containing the dimethyl dithiocarbamate group as the initiator
Publikováno v:
KOBUNSHI RONBUNSHU. 67:288-295
水溶液中で可逆的な温度応答性相分離能を示す有機-無機ハイブリッド材料として,ビス(エトキシエチル)アミド基と N,N-ジメチルアミノプロピル基を有するポリシルセスキオキサン(bEAPSQ)