Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Mikhail Treger"'
Autor:
Jean Jordan-Sweet, Eric Eisenbraun, Christian Witt, Mikhail Treger, Cyril Cabral, Ismail C. Noyan, Robert Rosenberg, Conal E. Murray
Publikováno v:
Thin Solid Films. 615:107-115
Room temperature recrystallization responses of blanket electroplated Cu thin films deposited under various conditions were monitored in real-time using synchrotron X-ray diffraction. Nominal control of electroplating parameters such as plating curre
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a519b6dfab5346563561e0e2a8f6edd0
https://doi.org/10.1016/j.tsf.2016.06.056
https://doi.org/10.1016/j.tsf.2016.06.056
Autor:
Ismail C. Noyan, Jean Jordan-Sweet, Eric Eisenbraun, Robert Rosenberg, C. Cabral, Mikhail Treger, Christian Witt, Conal E. Murray
Publikováno v:
Journal of Applied Physics. 113:214904
Concurrent in-situ four-point probe resistivity and high resolution synchrotron x-ray diffraction measurements were used to characterize room temperature recrystallization in electroplated Cu thin films. The x-ray data were used to obtain the variati
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f08bf8f21d1ffcf1e915f62541588f40
https://doi.org/10.1063/1.4807899
https://doi.org/10.1063/1.4807899
Publikováno v:
Journal of Applied Physics. 113:203515
The microstructural evolution within plated Cu films has been investigated using high-resolution x-ray diffraction, revealing a change in strain state within the recrystallized grains and the surrounding matrix with time. By approximating the case of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c15422012193bcd0bc3405f487720a3a
https://doi.org/10.1063/1.4807409
https://doi.org/10.1063/1.4807409