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pro vyhledávání: '"Mike Yeh"'
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Knowledge is one of the most important resources for organizations to sustain competitive advantages. Managers realized that the employees’ knowledge is a significant contribution factor to the core competency; however, it is difficult to e
Knowledge is one of the most important resources for organizations to sustain competitive advantages. Managers realized that the employees’ knowledge is a significant contribution factor to the core competency; however, it is difficult to e
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/81504538611596211713
Publikováno v:
SPIE Proceedings.
Most leading-edge IC fabs continue to use direct reticle inspection for "early warning" detection of haze defects before they print on wafers. This inspection strategy enables fabs to cost-effectively maintain the highest product yields possible. As
Publikováno v:
SPIE Proceedings.
Gate critical dimension (CD) common window (UDOF) is less than 0.25μm below 110nm-node. It's a serious impact by scanner leveling tilt due to it'll result in defocus, profile changed and then suffer etch bias. Here, we provide an easy and convenient
Autor:
Ronghao Tsai, Benjamin Szu-Min Lin, Shih-Hsien Liao, Y. Yu, Steven Fu, Wen-Kuang Lin, Calvino Hsieh, Mike Yeh, Thaddeus Gerard Dziura
Publikováno v:
SPIE Proceedings.
Lot-to-lot ADI CD data are generally used to tighten the variation of exposure energy of an exposure tool through an APC feedback system. With decreasing device size, the process window of an exposure tool becomes smaller and smaller. Therefore, whet
Autor:
Shu-Ping Fang, Ted Dziura, Steven Fu, Benjamin Szu-Min Lin, Chih-Chung Huang, Regina Freed, Bo-Jau Tsau, Mike Yeh, Mike D. Slessor, Jay Chih-Chieh Chen
Publikováno v:
Metrology, Inspection, and Process Control for Microlithography XVIII.
A small notch or foot existing at the bottom of a polysilicon gate is a common issue for etching processes. The small notch or foot could have a major impact on the length of the polysilicon gate, and the performance of the device would then be impac
Conference
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