Zobrazeno 1 - 10
of 24
pro vyhledávání: '"Mike Tsai"'
Autor:
Cojean, Terry, Nayak, Pratik, Ribizel, Tobias, Beams, Natalie, Mike Tsai, Yu-Hsiang, Koch, Marcel, Göbel, Fritz, Grützmacher, Thomas, Anzt, Hartwig
Publikováno v:
International Journal of High Performance Computing Applications; Nov2024, Vol. 38 Issue 6, p568-584, 17p
Publikováno v:
Parallel Processing and Applied Mathematics ISBN: 9783031304415
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::09d6023ca9fbb0d2240d2cf98a3cbf8d
https://doi.org/10.1007/978-3-031-30442-2_9
https://doi.org/10.1007/978-3-031-30442-2_9
Publikováno v:
2022 IEEE/ACM Workshop on Latest Advances in Scalable Algorithms for Large-Scale Heterogeneous Systems (ScalAH).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::19e68d0cbf4dfbfa9ba49fcd99d60b0b
https://doi.org/10.1109/scalah56622.2022.00006
https://doi.org/10.1109/scalah56622.2022.00006
Autor:
Mike Tsai, Wynn Li, Ethan Ding, Tim Chang, Kevin Chang, Karina Chang, Eric He, J. Y. Chen, Rios Hsieh, Ryan Chiu, James Lin
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::addc762639113133a8cea44ade8b136a
https://doi.org/10.1109/ectc51906.2022.00011
https://doi.org/10.1109/ectc51906.2022.00011
Publikováno v:
Parallel Computing, 111, Art.-Nr.: 102902
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::d39d686b7fd059be0265c2f560aa74a2
Autor:
Mike Tsai, Ryan Chiu, James Lin, Yuan Jie, Azure Lin, Eddie Zheng, Jason Tsai, Bruce Lin, Ming-Fan Tsai, Erico Yang, J. Y. Chen
Publikováno v:
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ceaa584f4dfafca729d56dddfc5e6d79
https://doi.org/10.1109/eptc53413.2021.9663894
https://doi.org/10.1109/eptc53413.2021.9663894
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
Double Side SiP is hot packaging solution by using double side SMT technology and dual side molding to shrink the overall module size. The calculation of package size can be reduce over 40% PCB placement area from 8 x 8mm to 6 x 6mm. Based on module
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6f5b3efab6cb569371dcf3820fb87e38
https://doi.org/10.1109/ectc32696.2021.00170
https://doi.org/10.1109/ectc32696.2021.00170
Autor:
Frank Chu, Yu-Po Wang, Mike Tsai, Jay Li, Alex Hsieh, Shunyu Jian, J. Y. Chen, Eric He, Ming-fan Tsai, Simon Chen, Ryan Chiu
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
The 5G revolution have brought about the huge impact for the communication industry which produces a series of innovative technologies, such as Sub 6Ghz and millimmeter wave (mmWave) 28Ghz spectrum, beam forming, multiconnectivity and edge computing
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b42fee5003db820d7fb4888be18e09d0
https://doi.org/10.1109/ectc32862.2020.00152
https://doi.org/10.1109/ectc32862.2020.00152
Autor:
Mike Tsai, Jensen Tsai, Simon Chen, Ryan Chiu, J. Y. Chen, Shunyu Jian, Eric He, Yu-Po Wang, Frank Chu
Publikováno v:
2019 IEEE 21st Electronics Packaging Technology Conference (EPTC).
Recently, the high growing semiconductor is the Internet of Things (IoT) and fifth generation (5G) connectivity application. Based on 5G, the different working frequency between sub 6GHz and millimeter wave (mmWave) frequency range on 28GHz and 39GHz
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a4fb11728a6cc28cbdad7cdfba845823
https://doi.org/10.1109/eptc47984.2019.9026564
https://doi.org/10.1109/eptc47984.2019.9026564