Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Mike Phenis"'
Publikováno v:
International Symposium on Microelectronics. 2015:000121-000125
The Bosch etch process is a critical process step used to create through silicon vias (TSVs) for 3D integrated circuit manufacturing. During the Bosch etch, a fluoropolymer passivation layer is formed on the sidewall of TSVs to help achieve a vertica
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::35d2b9e6f2a6b80840b84c04a3f7a51b
https://doi.org/10.4071/isom-2015-tp45
https://doi.org/10.4071/isom-2015-tp45
Autor:
Mike Phenis, Richie Peters, Kimberly Dona Pollard, Ramey Youssef, Meng Guo, John Taddei, John Clark, Laura Mauer
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2014:001435-001469
The continuing challenge to meet the need for lighter, smaller, faster and smarter electronic systems has pushed the advancement of 2.5D and 3D technology. The ability to create and integrate through-silicon vias (TSV) into device designs in 2.5- and
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c9b03d552cc2223b8e281ebe6b6017d3
https://doi.org/10.4071/2014dpc-wp12
https://doi.org/10.4071/2014dpc-wp12