Zobrazeno 1 - 10
of 32
pro vyhledávání: '"Mike Mello"'
Autor:
Paul Zimmerman, Rajen Dias, Mike Mello, Lars D. Skoglund, George F. Raiser, Vasudeva Atluri, Robert Hernandez, Vijay Gupta
Publikováno v:
International Symposium for Testing and Failure Analysis.
A laser spallation technique to measure the tensile strength of thin film interfaces is introduced. In this technique, a laser-generated stress wave of nanosecond duration in the substrate spalls off (completely removes) a coating deposited on the su
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a70f470c69402e66ace0baaa7c5d5368
https://doi.org/10.31399/asm.cp.istfa2000p0025
https://doi.org/10.31399/asm.cp.istfa2000p0025
Infrared diffraction interferometer for coplanarity measurement of high-density solder bump pattern.
Autor:
Mike Mello
Publikováno v:
Optical Engineering; Apr2004, Vol. 43 Issue 4, p888-894, 7p
Publikováno v:
Fairfield County Business Journal. 3/23/2015, Vol. 51 Issue 12, p21-29. 6p.
Autor:
Pacheco, Mario1, Zhiyong Wang1, Skoglund, Lars1, Yongmei Liu1, Medina, Ariel1, Raman, Arun1, Dias, Rajen1, Goyal, Deepak1, Ramanathan, Shriram1
Publikováno v:
Intel Technology Journal. Nov2005, Vol. 9 Issue 4, p337-352. 16p.
Autor:
Rolfsen, Bruce
Publikováno v:
Air Force Times; 12/13/2010, Vol. 71 Issue 22, p22-23, 2p, 3 Color Photographs
Publikováno v:
2004 Proceedings 54th Electronic Components & Technology Conference (IEEE Cat. No.04CH37546); 2004, piii-xxiii, 21p
An accelerated reliability test method to predict thermal grease pump-out in flip-chip applications.
Publikováno v:
2001 Proceedings 51st Electronic Components & Technology Conference (Cat. No.01CH37220); 2001, p91-97, 7p
Publikováno v:
2000 Proceedings of the Forty-Sixth IEEE Holm Conference on Electrical Contacts, Electrical Contacts (Cat. No.00CB37081); 2000, p36-46, 11p
Autor:
Goh, T.J.
Publikováno v:
Proceedings of 2nd Electronics Packaging Technology Conference (Cat No98EX235); 1998, p57-62, 6p
Publikováno v:
Alcohol & Alcoholism; Nov/Dec2010, Vol. 45 Issue 6, p514-519, 6p