Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Mike Leddige"'
Autor:
James E. Jaussi, Kent E. Mallory, Victor Prokofiev, Mike Leddige, Mark B. Trobough, Bryce D. Horine, Jason A. Mix, P.C.H. Meier, Rajashree Baskaran, Henning Braunisch, Daoqiang Lu, Dong-Ho Han
Publikováno v:
IEEE Transactions on Advanced Packaging. 31:82-90
High-speed chip-to-chip interconnect utilizing flex-circuit technology is investigated for extending the lifetime of copper-based system-level channels. Proper construction of the flex ribbon is shown to improve the raw bandwidth over standard FR-4 b
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9297ad294ed40fe2c1a8584dc01c015f
https://doi.org/10.1109/tadvp.2007.909451
https://doi.org/10.1109/tadvp.2007.909451
Publikováno v:
19th Topical Meeting on Electrical Performance of Electronic Packaging and Systems.
The co-design of a 10Gb/s 45nm CMOS transceiver and low-loss interconnect for parallel links demonstrates 1.4–2.4pJ/bit I/O power efficiency. A C4 bump pattern with an effective 20∶3 signal to ground ratio is implemented with on-die transmission
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::011fd27dc12a0fc062215b9ea69b04af
https://doi.org/10.1109/epeps.2010.5642529
https://doi.org/10.1109/epeps.2010.5642529
Autor:
Dong-Ho Han, Mike Leddige, Jason A. Mix, Daoqiang Lu, Bryce D. Horine, Kent E. Mallory, P.C.H. Meier, M.B. Trobough, Rajashree Baskaran, Victor Prokofiev, Henning Braunisch, James E. Jaussi
Publikováno v:
56th Electronic Components and Technology Conference 2006.
High-speed chip-to-chip interconnect utilizing flex-circuit technology is investigated for extending the lifetime of copper-based system-level channels. Proper construction of the flex ribbon is shown to improve the raw bandwidth over FR-4 boards by
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b4d87ffbed3de52732bff3d1fa3d95fc
https://doi.org/10.1109/ectc.2006.1645912
https://doi.org/10.1109/ectc.2006.1645912