Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Mike Hoffmann"'
Autor:
Sean Jellesmark, Tim M. Blackburn, Shawn Dove, Jonas Geldmann, Piero Visconti, Richard D. Gregory, Louise McRae, Mike Hoffmann
SummaryIn recent years, vertebrate population abundance has declined at unprecedented rates (WWF 2020). In response, targeted conservation measures – such as breeding programs or species-specific habitat management – have been applied to halt pop
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::256a9539d632fda4c823756bf59d5038
https://doi.org/10.1101/2022.01.14.476374
https://doi.org/10.1101/2022.01.14.476374
Autor:
Sean Jellesmark, Malcolm Ausden, Tim M. Blackburn, Richard D. Gregory, Mike Hoffmann, Dario Massimino, Piero Visconti
Wet grassland wader populations in the United Kingdom have experienced severe declines over the last three decades. To help mitigate these declines, the Royal Society for the Protection of Birds (RSPB) has restored and managed lowland wet grassland n
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od______2659::3990cbac0c260a923be64fbd57ced2f8
https://zenodo.org/record/4475515
https://zenodo.org/record/4475515
Autor:
Mike Hoffmann, Patrik Carazzetti, Ewald Strolz, Andreas Erhart, Juergen Weichart, Frantisek Balon
Publikováno v:
2017 IEEE 19th Electronics Packaging Technology Conference (EPTC).
This work analyzes the key performance of two different multi-chamber PVD systems used in volume WLP manufacturing. These are the Cluster-type and the Indexer-type platforms, respectively. It is emphasized how the faster wafer handling, which is a un
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6599b236ff85f1a08a208e7518f04aff
https://doi.org/10.1109/eptc.2017.8277518
https://doi.org/10.1109/eptc.2017.8277518
Autor:
Patrik Carazzetti, Mike Hoffmann, Frantisek Balon, Ewald Strolz, Kay Viehweger, Andreas Erhart, Juergen Weichart
Publikováno v:
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
The design flexibility of FOWLP plays a crucial role in meeting the rising demand for higher performance advanced semiconductor packages at lower cost. From a manufacturing standpoint, the requirements are not only for increased wafer throughput and
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5724e71c898264a74037e46c0e639788
https://doi.org/10.1109/ectc.2017.280
https://doi.org/10.1109/ectc.2017.280
Publikováno v:
2017 China Semiconductor Technology International Conference (CSTIC).
Advanced Packaging relies heavily on the use of organic/polymer films and mold wafers such as Fan-Out Wafer-Level-Packages (FOWLP). Processing of such wafers poses challenges, potentially resulting in a high contact resistance (Rc), yield loss, incre
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::805ea0f444593e2a40281a7f6f9d1123
https://doi.org/10.1109/cstic.2017.7919872
https://doi.org/10.1109/cstic.2017.7919872