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Publikováno v:
Journal of Electronic Materials. 25:1623-1627
Optical interferometry was used to quantitatively characterize the surface of chemical-mechanical polishing (CMP) pads used to polish oxide films. We discuss the optical interferometry technique, including a description of the parameters necessary to
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::95b06d657bc26b2f10d421b3c746ce52
https://doi.org/10.1007/bf02655586
https://doi.org/10.1007/bf02655586
