Zobrazeno 1 - 10
of 23
pro vyhledávání: '"Mikael Antelius"'
Publikováno v:
Sensors and Actuators B: Chemical. 209:639-644
A MEMS-based amperometric nitric oxide (NO) gas sensor is reported in this paper. The sensor is designed to detect NO gas for the purpose of asthma monitoring. The unique property of this sensor li ...
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fd76c5655d88a0cd6434382cd311026c
https://doi.org/10.1016/j.snb.2014.11.147
https://doi.org/10.1016/j.snb.2014.11.147
This paper reports a narrow footprint sealing ring design for low-temperature, hermetic, and mechanically stable wafer-level packaging. Copper (Cu) sealing rings that are as narrow as 8 μm successfully seal the enclosed cavities on the wafers after
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::507909f17015fc6ebd7577524fba69f9
http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-216276
http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-216276
Publikováno v:
Journal of Microelectromechanical Systems
Wafer-level vacuum packaging is vital in the fabrication of many microelectromechanical systems (MEMS) devices and enables significant cost reduction in high-volume MEMS production. In this paper, we propose a low-temperature wafer-level vacuum packa
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::52a25ba6977d8e59efabb9e60721e767
http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-205604
http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-205604
Autor:
Frank Niklaus, Mikael Antelius, Alessandro Tocchio, Göran Stemme, Martin Lapisa, Hans Sohlström
Publikováno v:
Sensors and Actuators A: Physical
This paper reports on a novel wafer-level packaging method employing gold gaskets and an epoxy underfill. The packaging is done at room-temperature and atmospheric pressure. The mild packaging cond ...
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::991a057b8fba73fb07549f4bb2f885cc
https://doi.org/10.1016/j.sna.2013.07.007
https://doi.org/10.1016/j.sna.2013.07.007
Autor:
Francisco J. Sanza, Santiago Cáceres, Fabian Dortu, Martin Lapisa, Rafael Casquel, Angel Barranco, Damien Bernier, Amadeu Griol, Agustín R. González-Elipe, Frank Niklaus, Miguel Holgado, Hans Sohlström, Francisco J. Aparicio, Maria Alcaire, Mikael Antelius
Publikováno v:
Digital.CSIC. Repositorio Institucional del CSIC
instname
RiuNet. Repositorio Institucional de la Universitat Politécnica de Valéncia
instname
RiuNet. Repositorio Institucional de la Universitat Politécnica de Valéncia
[EN] We report on dye-based photonic sensing systems which are fabricated and packaged at wafer scale. For the first time luminescent organic nanocomposite thin-films deposited by plasma technology are integrated in photonic sensing systems as active
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::c51dfd0eef0410ad1d80932a9f3203c7
http://hdl.handle.net/10261/191110
http://hdl.handle.net/10261/191110
Publikováno v:
Journal of Physics: Conference Series. 922:012002
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::efd6e34c0502aaeba369491ea16895e7
https://doi.org/10.1088/1742-6596/922/1/012002
https://doi.org/10.1088/1742-6596/922/1/012002
Publikováno v:
Journal of Microelectromechanical Systems
This paper reports on the investigation of a novel room-temperature vacuum sealing method based on compressing wire bonded gold bumps which are placed to partially overlap the access ports into the cavity. The bump compression, which is done under va
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::96d41d66d15b2d92e2966f2b36eabeae
Publikováno v:
2013 IEEE 26th International Conference on Micro Electro Mechanical Systems (MEMS).
This paper reports on a novel miniaturized MEMS-based amperometric nitric oxide sensor that is suitable for a point of care testing device for asthma. The novelty lies in the combination of a high surface area microporous structured electrode, nano-s
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::742621ddc9d92dfeb739f70a07344ae4
https://doi.org/10.1109/memsys.2013.6474416
https://doi.org/10.1109/memsys.2013.6474416
Publikováno v:
Journal of Micromechanics and Microengineering
This paper reports a novel room-temperature hermetic liquid sealing process where the access ports of liquid-filled cavities are sealed with wire-bonded stud bumps. This process enables liquids to be integrated at the fabrication stage. Evaluation ca
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::fb9a1b8a4c64162daa59955fed1c9b82
Publikováno v:
2011 16th International Solid-State Sensors, Actuators and Microsystems Conference.
This paper reports experimental results of a novel room temperature vacuum sealing process based on compressing wire bonded gold “bumps”, causing a material flow into the access ports of vacuum-cavities. The leak rate out of manufactured cavities
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::5e231d907466baa86dd61edef4d37b66
https://doi.org/10.1109/transducers.2011.5969522
https://doi.org/10.1109/transducers.2011.5969522