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Autor:
Mijanur Rahman ATM; Center for Intelligent Agro-Food Packaging (CIFP), Department of Food Science and Biotechnology, Dongguk University, Seoul 10326, Korea. mijananftiubd@gmail.com., Kim DH; Center for Intelligent Agro-Food Packaging (CIFP), Department of Food Science and Biotechnology, Dongguk University, Seoul 10326, Korea. goreh1@naver.com., Jang HD; Center for Intelligent Agro-Food Packaging (CIFP), Department of Food Science and Biotechnology, Dongguk University, Seoul 10326, Korea. gksehd7609@naver.com., Yang JH; Center for Intelligent Agro-Food Packaging (CIFP), Department of Food Science and Biotechnology, Dongguk University, Seoul 10326, Korea. alsdn4547@naver.com., Lee SJ; Center for Intelligent Agro-Food Packaging (CIFP), Department of Food Science and Biotechnology, Dongguk University, Seoul 10326, Korea. Lseungju@dongguk.edu.
Publikováno v:
Sensors (Basel, Switzerland) [Sensors (Basel)] 2018 Jun 15; Vol. 18 (6). Date of Electronic Publication: 2018 Jun 15.