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pro vyhledávání: '"Mihir D. Boal"'
Autor:
Mihir D. Boal, D. Ahmasi Harris, Louise C. Sengupta, Evan A. Binkerd, Don McManus, Auroux Pierre-Alain S, Jeffrey F. Bryant, Richard J. Blackwell
Publikováno v:
SPIE Proceedings.
BAE Systems' SMART (Stacked Modular Architecture High-Resolution Thermal) Chip Camera provides very compact long-wave infrared (LWIR) solutions by combining a 12 μm wafer-level packaged focal plane array (FPA) with multichip-stack, application-speci
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::83b69d35135d15311c6c0d0f5ebc7a72
https://doi.org/10.1117/12.2177011
https://doi.org/10.1117/12.2177011
