Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Mihai Varlan"'
Autor:
Nikolay Radimov, Chris Gerolami, Peter Preston-Thomas, Tanya Kirilova Gachovska, Christian Cojocaru, Mihai Varlan, Tudor Lipan, Gabriel Scarlatescu
Publikováno v:
2017 IEEE Applied Power Electronics Conference and Exposition (APEC).
Increased component integration is essential for new power circuit platforms to decrease cost and size, and increase efficiency and reliability. A 300 W four quadrant (4Q) photo-voltaic grid-tied micro-inverter using two new ASICs (Application Specif
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f64dfad1b1a6afa4fc2de6fcf43139ea
https://doi.org/10.1109/apec.2017.7931136
https://doi.org/10.1109/apec.2017.7931136
Autor:
Nikolay Radimov, Chris Gerolami, Tanya Kirilova Gachovska, Gabriel Scarlatescu, Tudor Lipan, Mihai Varlan
Publikováno v:
2016 IEEE Electrical Power and Energy Conference (EPEC).
Power integration in power electronic circuits is important for new circuit designs since it tends to decrease the bill of materials, cost, and size of an application, with the added benefit of an increase in reliability. A functional description of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ab421d4bc8fa87a8b8feec78e4b8976e
https://doi.org/10.1109/epec.2016.7771684
https://doi.org/10.1109/epec.2016.7771684
Autor:
Chris Gerolami, Nikolay Radimov, Seste Dell'Aera, Gabriel Scarlatescu, Tony Reinberger, Ray Orr, Mihai Varlan, Arthur Chung, Tudor Lipan, Tanya Kirilova Gachovska
Publikováno v:
2015 IEEE Energy Conversion Congress and Exposition (ECCE).
Integration of functions and features into silicon circuits is very important for a new power circuit design in order to reduce the electronic bill of material's (eBOM) cost and component count. These eBOM reductions increase the reliability and decr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::60265ce458b6c559c4664bfcdcc501f6
https://doi.org/10.1109/ecce.2015.7309725
https://doi.org/10.1109/ecce.2015.7309725
Autor:
Igor Miletic, Vinod Narayan, Tudor Lipan, Christian Cojocaru, Tanya Kirilova Gachovska, Vincent Karam, Mihai Varlan
Publikováno v:
2015 IEEE Energy Conversion Congress and Exposition (ECCE).
High level IC integration in power electronic circuits is increasingly important for new circuit designs. This integration is essential in order to decrease the components used which inherently increases the reliability and decreases the cost and siz
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::47ab63c94a723a6ea37fccac6195bb56
https://doi.org/10.1109/ecce.2015.7310081
https://doi.org/10.1109/ecce.2015.7310081
Autor:
Olivier Trescases, Mihai Varlan, Lucas Marcelino Dos Santos, Husam Hussein, Miad Fard, Tudor Lipan, Shahab Poshtkouhi
Publikováno v:
2014 IEEE Applied Power Electronics Conference and Exposition - APEC 2014.
This work targets modular nanogrids for remote locations, where photovoltaic modules can be gradually introduced to grow the renewable energy capacity at minimal capital cost, while reducing diesel fuel consumption. Today's grid-tied micro-inverters
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::93090f6977eb5a4a74d96ccf1d34ec39
https://doi.org/10.1109/apec.2014.6803376
https://doi.org/10.1109/apec.2014.6803376
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