Zobrazeno 1 - 10
of 49
pro vyhledávání: '"Microelectronics and interconnection technology [3]"'
Autor:
Oscar Alonso, E. Vilella, L. Garrido, Angel Dieguez, Marcel Vos, J. Trenado, Anna Vilà, Raimon Casanova
Publikováno v:
Nucl. Instrum. Methods Phys. Res., A, (2012) pp. 199-204
It is well known that avalanche photodiodes operated in the Geiger mode above the breakdown voltage offer a virtually infinite gain and time accuracy in the picosecond range that can be used for single photon detection. However, their performance in
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::dfec55b15543f259735ca46f40890a1e
https://doi.org/10.1016/j.nima.2012.08.026
https://doi.org/10.1016/j.nima.2012.08.026
Publikováno v:
JINST, (2014) pp. P10005
The foreseen Phase 2 pixel upgrades at the LHC have very challenging requirements for the design of hybrid pixel readout chips. A versatile pixel simulation platform is as an essential development tool for the design, verification and optimization of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::aa582c8df138311d235fae17a5c02ce0
http://cds.cern.ch/record/1750098
http://cds.cern.ch/record/1750098
Publikováno v:
JINST, (2014) pp. C01003
Luminosity upgrade of the LHC (HL-LHC) imposes severe constraints on the detector tracking systems in terms of radiation hardness and capability to cope with higher hit rates. One possible way of keeping track with increasing luminosity is the usage
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::2bf4421575f57d4796574330c16bb1de
http://cds.cern.ch/record/1997604
http://cds.cern.ch/record/1997604
Autor:
Moser, H-G
3D interconnection with TSVs (through silicon via) allows the construction of quasi-monolithic multi-tier ASICs, a technology which offers many advantages. In addition to increasing the avail- able area the main advantage is in shortening the length
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od________65::678edc913becc3d4db082cd5865de48e
http://cds.cern.ch/record/1693477
http://cds.cern.ch/record/1693477
Autor:
Andricek, L, Beimforde, M, Macchiolo, A, Moser, H.G, Nisius, R, Richter, R.H, Terzo, S, Weigell, P
Publikováno v:
Nucl. Instrum. Methods Phys. Res., A, (2014) pp. 30-43
The performance of pixel modules built from 75 micrometer thin silicon sensors and ATLAS read-out chips employing the Solid Liquid InterDiffusion (SLID) interconnection technology is presented. This technology, developed by the Fraunhofer EMFT, is a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od________65::b911597280d24dd8c2054dd85867be37
http://cds.cern.ch/record/2000313
http://cds.cern.ch/record/2000313