Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Mickael Pommier"'
Publikováno v:
2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D).
Low temperature solders usage for broadband assemblies represent an important challenge for the industry. Using lower temperatures for reflow subsequently shows less deformation on mother boards used for optical sub-assemblies and then less RF parasi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b30673c6f047a40d68530cab48fdf00f
https://doi.org/10.1109/ltb-3d53950.2021.9598388
https://doi.org/10.1109/ltb-3d53950.2021.9598388
Autor:
Mickael Pommier, K Katarzyna Nowak, S Iochem, Sophie Ledain, Eric Pieraerts, L Guiraud, Henk Jan Bergveld, Jorge Ferreira, Catherine Bunel, F. Le Cornec, Fred Roozeboom
Publikováno v:
Procedia Chemistry. 1:1435-1438
This paper addresses silicon-based integration of passive components applied to 3D integration with dies of other technologies within one package. Particularly, the development of high-density trench capacitors has enabled the realization of small-fo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::b30dd400a2136dd37b889918e6276acc
https://doi.org/10.1016/j.proche.2009.07.358
https://doi.org/10.1016/j.proche.2009.07.358
Publikováno v:
2012 4th Electronic System-Integration Technology Conference.
• The low profile IPDIA technology capability is limited by the density of the trench capacitor, more explicitly by the depth of the trench. • The 80μm Low Profile node dedicated to the highest capacitor density is qualified. • IPDIA is provid
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::68031b6bd53bed79fbeb38b3d832919f
https://doi.org/10.1109/estc.2012.6542168
https://doi.org/10.1109/estc.2012.6542168
Autor:
Ravi Karadi, Mickael Pommier, Sebastien Iochem, Jorge Ferreira, Sophie Ledain, K Katarzyna Nowak, Henk Jan Bergveld, Eric Pieraerts
Publikováno v:
Proc. IEEE Energy Conversion Congress and Exposition (ECCE'09), San Jose, USA, 20-24 Sept. 2009, 3698-3705
STARTPAGE=3698;ENDPAGE=3705;TITLE=Proc. IEEE Energy Conversion Congress and Exposition (ECCE'09), San Jose, USA, 20-24 Sept. 2009
STARTPAGE=3698;ENDPAGE=3705;TITLE=Proc. IEEE Energy Conversion Congress and Exposition (ECCE'09), San Jose, USA, 20-24 Sept. 2009
The increasing number of efficient voltage conversions realized in small volumes in many applications has introduced a trend towards small-form-factor DC-DC converters with integrated passives. Preferably, the DC-DC converter is integrated with the l
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::0f77a9288463318eef92821b8b2107fc
https://doi.org/10.1109/ecce.2009.5316334
https://doi.org/10.1109/ecce.2009.5316334