Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Michiel Oosting"'
Autor:
Jeroen van Engelshoven, Heike Richter, Marcel Niestadt, David Foord, Emrah Yücelen, Dennis Cats, Vincent Jongenelen, Michiel Oosting, Mikhail Ovsyanko
Publikováno v:
Microscopy and Microanalysis. 22:52-53
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bafd90bfb5e2345a5169b46f919d86c3
https://doi.org/10.1017/s1431927616001112
https://doi.org/10.1017/s1431927616001112
Autor:
Michiel Oosting, Leonid Vasilvey, Lukas Drybcak, Michael DiBattista, Gavin Hartigan, Kimball Skinner, Rick Kneedler, Jiri Zbranek
Publikováno v:
Scopus-Elsevier
Circuit edit and failure analysis require tungsten deposition parameters to accomplish different goals. Circuit edit applications desire low resistivity values for rewiring, while failure analysis requires high deposition rates for capping layers. Tu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::14c4e6e0e94e56206ebfba282d6e8b00
http://www.scopus.com/inward/record.url?eid=2-s2.0-49649094289&partnerID=MN8TOARS
http://www.scopus.com/inward/record.url?eid=2-s2.0-49649094289&partnerID=MN8TOARS
This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers cover a wide range of testing and failure analysis topics of practical value to anyone working to detec